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NLV27WZ08USG

Onsemi

NLV27WZ08USG by Onsemi

NLV27WZ08USG by Onsemi is a Logic Gate with 2 functions, AEC-Q101 screening level, and 11ns propagation delay. It operates at -55 to 125 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for military-grade applications requiring fast response times in compact spaces.

Median Price

$0.276

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11,207 parts In-Stock

1+ parts

$0.387

100+ parts

$0.344

1k+ parts

$0.277

10k+ parts

$0.238

11,207

$0.387

$0.344

$0.277

$0.238

Element14

Singapore . 5,079 parts In-Stock

1+ parts

$1.950

100+ parts

$1.060

1k+ parts

$0.555

10k+ parts

$0.431

5,079

$1.950

$1.060

$0.555

$0.431

Mouser Electronics

USA . 33,041 parts In-Stock

1+ parts

-

100+ parts

-

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$0.275

33,041

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$0.275

DigiKey

USA . 12,000 parts In-Stock

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$0.190

12,000

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$0.190

Verical

USA . 10,207 parts In-Stock

1+ parts

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$0.238

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10,207

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$0.238

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Flip Electronics (Authorized)

USA . 9,000 parts In-Stock

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Farnell

UK . 4,938 parts In-Stock

1+ parts

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$0.276

10k+ parts

$0.270

4,938

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-

$0.276

$0.270

Chip1Stop

Japan . 2,873 parts In-Stock

1+ parts

-

100+ parts

$0.345

1k+ parts

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$0.235

2,873

-

$0.345

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$0.235

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,219 parts In-Stock

1+ parts

$0.226

100+ parts

-

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1,219

$0.226

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$0.374

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650

$0.374

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Bristol Electronics

USA . 11,980 parts In-Stock

1+ parts

$0.825

100+ parts

$0.305

1k+ parts

$0.214

10k+ parts

-

11,980

$0.825

$0.305

$0.214

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Chip Stock

USA . 42,000 parts In-Stock

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Flip Electronics

USA . 12,000 parts In-Stock

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Dan-Mar Components

USA . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 8,351 parts In-Stock

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8,351

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ComSIT Distribution GmbH

Germany . 3,435 parts In-Stock

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3,435

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ComSIT USA

USA . 3,435 parts In-Stock

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Microfarads

USA . 2,816 parts In-Stock

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Prism Electronics

USA . 347 parts In-Stock

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347

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Distributors (Availability)

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Semicontronic

India . 8,258 parts In-Stock

1+ parts

$0.178

100+ parts

$0.174

1k+ parts

$0.173

10k+ parts

-

8,258

$0.178

$0.174

$0.173

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Ampacity Inc.

Singapore . 8,032 parts In-Stock

1+ parts

$0.178

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8,032

$0.178

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Corohmni

South Africa . 302 parts In-Stock

1+ parts

$0.210

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302

$0.210

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Corphita

USA . 2,200 parts In-Stock

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$0.214

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2,200

$0.214

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.366

100+ parts

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$0.351

10k+ parts

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2,000

$0.366

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$0.351

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Continental Prestige Electronics

USA . 2,579 parts In-Stock

1+ parts

$0.373

100+ parts

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$0.366

2,579

$0.373

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$0.366

Argo Parts USA

USA . 120 parts In-Stock

1+ parts

$0.373

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$0.362

120

$0.373

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$0.362

Vigor

Singapore . 948 parts In-Stock

1+ parts

$0.870

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948

$0.870

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Microchip USA

USA . 2,379 parts In-Stock

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$2.198

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2,379

$2.198

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Aztec Data Supply Inc.

USA . 3,277 parts In-Stock

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$27.120

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$27.120

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Perfect Parts

USA . 722,277 parts In-Stock

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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Lixinc

USA . 10,556 parts In-Stock

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TANS Electronics

Latvia . 5,063 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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Problanco Electronics

Mexico . 3,477 parts In-Stock

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Kulean Microsystems

USA . 3,184 parts In-Stock

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Infinite Electronics LLP (Excess)

. 3,043 parts In-Stock

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3,043

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SupplyDigital Components

Austria . 531 parts In-Stock

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531

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UHIMA Technologies

Türkiye . 442 parts In-Stock

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442

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Overview

Discover the power of precision with the NLV27WZ08USG by Onsemi. Crafted with the highest quality materials and cutting-edge technology, this logic gate boasts unparalleled performance and reliability. Ideal for a wide range of applications, this compact and versatile component offers customers unmatched value and efficiency. Elevate your projects to new heights with the NLV27WZ08USG - the perfect blend of innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 2.3

This specific voltage requirement makes the logic gates compatible with a wide range of applications.

Propagation Delay (tpd): 11 ns

Provides fast response times, crucial for time-sensitive applications that require quick processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy efficient and reliable.

Technical Specifications

Logic Gates NLV27WZ08USG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q101

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NLV27WZ08USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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