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NLV27WZ86USG

Onsemi

NLV27WZ86USG by Onsemi

NLV27WZ86USG by Onsemi is a Logic Gate with 2 functions, 2 inputs, and 5.9 ns propagation delay. It operates at -40 to 125 °C and has a supply voltage range of 1.65-5.5 V, making it ideal for automotive applications requiring fast signal processing in compact designs.

Median Price

$0.255

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 887 parts In-Stock

1+ parts

$0.401

100+ parts

$0.181

1k+ parts

$0.108

10k+ parts

$0.087

887

$0.401

$0.181

$0.108

$0.087

DigiKey

USA . 174,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.350

174,000

-

-

-

$0.350

Flip Electronics (Authorized)

USA . 174,000 parts In-Stock

1+ parts

-

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174,000

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Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.094

6,000

-

-

-

$0.094

Verical

USA . 1,980 parts In-Stock

1+ parts

-

100+ parts

$0.160

1k+ parts

$0.081

10k+ parts

-

1,980

-

$0.160

$0.081

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,261 parts In-Stock

1+ parts

$0.094

100+ parts

-

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-

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1,261

$0.094

-

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Digiode

USA . 2,257 parts In-Stock

1+ parts

$0.381

100+ parts

-

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2,257

$0.381

-

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Flip Electronics

USA . 153,000 parts In-Stock

1+ parts

-

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153,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 202 parts In-Stock

1+ parts

$0.094

100+ parts

-

1k+ parts

-

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-

202

$0.094

-

-

-

Vigor

Singapore . 441 parts In-Stock

1+ parts

$0.310

100+ parts

-

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441

$0.310

-

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Corphita

USA . 2,034 parts In-Stock

1+ parts

$0.361

100+ parts

-

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10k+ parts

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2,034

$0.361

-

-

-

Microchip USA

USA . 119 parts In-Stock

1+ parts

$29.060

100+ parts

$28.970

1k+ parts

$28.970

10k+ parts

$28.880

119

$29.060

$28.970

$28.970

$28.880

Problanco Electronics

Mexico . 7,225 parts In-Stock

1+ parts

-

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7,225

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Glotronic Ltd.

UK . 6,400 parts In-Stock

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6,400

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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QUARKTWIN TECHNOLOGY LTD

USA . 2,769 parts In-Stock

1+ parts

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2,769

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TANS Electronics

Latvia . 2,376 parts In-Stock

1+ parts

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2,376

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Kulean Microsystems

USA . 1,108 parts In-Stock

1+ parts

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1,108

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UHIMA Technologies

Türkiye . 865 parts In-Stock

1+ parts

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865

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SupplyDigital Components

Austria . 249 parts In-Stock

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249

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Overview

Enhance your automotive electronic systems with the NLV27WZ86USG logic gates from Onsemi. Designed with precision and reliability in mind, these logic gates offer fast propagation delay and low power consumption, making them ideal for a wide range of applications in the automotive industry. With Onsemi's reputation for quality and innovation, you can trust that this product will deliver exceptional performance and longevity. Upgrade your designs today and experience the difference with the NLV27WZ86USG logic gates.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, ideal for automotive applications where weight and reliability are important factors.

Propagation Delay At Nominal Supply: 5.9 ns

With a fast propagation delay of 5.9 ns, this logic gate ensures quick response times in signal processing and decision-making, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate onto circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 2

Having 2 functions in a single package increases the efficiency and complexity of logic operations that can be performed with this product.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening standards ensures high reliability and performance, making this logic gate suitable for automotive and other demanding applications.

Technical Specifications

Logic Gates NLV27WZ86USG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

10.5 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

NLV27WZ86USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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