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NLV27WZ07DFT2G

Onsemi

NLV27WZ07DFT2G by Onsemi

NLV27WZ07DFT2G by Onsemi is a Logic Gate with 4.8ns Propagation Delay, suitable for AEC-Q101 applications. It operates at 3.3V with 6 terminals and offers a max I (ol) of 24Amp. The device has a MILITARY Temperature Grade, -55 to 125 °C operating range, and features OPEN-DRAIN output characteristics.

Median Price

$0.064

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,034,017 parts In-Stock

1+ parts

$0.164

100+ parts

$0.058

1k+ parts

$0.046

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-

1,034,017

$0.164

$0.058

$0.046

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DigiKey

USA . 2,865 parts In-Stock

1+ parts

$0.850

100+ parts

$0.573

1k+ parts

$0.363

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2,865

$0.850

$0.573

$0.363

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Verical

USA . 1,034,017 parts In-Stock

1+ parts

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$0.046

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1,034,017

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$0.046

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Flip Electronics (Authorized)

USA . 168,000 parts In-Stock

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Future Electronics

Canada . 108,000 parts In-Stock

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$0.060

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$0.060

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$0.060

$0.060

Chip1Stop

Japan . 3,000 parts In-Stock

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$0.063

3,000

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$0.063

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.066

1k+ parts

$0.055

10k+ parts

$0.049

3,000

-

$0.066

$0.055

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Maritex

Poland . 2,726 parts In-Stock

1+ parts

$0.165

100+ parts

$0.086

1k+ parts

$0.081

10k+ parts

$0.072

2,726

$0.165

$0.086

$0.081

$0.072

Digiode

USA . 794 parts In-Stock

1+ parts

$0.357

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794

$0.357

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Vyrian

USA . 348,406 parts In-Stock

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Flip Electronics

USA . 168,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,845 parts In-Stock

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2,845

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ComSIT Distribution GmbH

Germany . 2,543 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 348,614 parts In-Stock

1+ parts

$0.051

100+ parts

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348,614

$0.051

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Corohmni

South Africa . 257 parts In-Stock

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$0.060

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257

$0.060

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Corphita

USA . 1,083 parts In-Stock

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$0.338

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1,083

$0.338

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Vigor

Singapore . 736 parts In-Stock

1+ parts

$0.870

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736

$0.870

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Aztec Data Supply Inc.

USA . 2,592 parts In-Stock

1+ parts

$9.330

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2,592

$9.330

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GreenTree Electronics

Israel . 222,000 parts In-Stock

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Component Connect

USA . 218,301 parts In-Stock

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Eastek

USA . 114,000 parts In-Stock

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$0.080

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Lixinc

USA . 11,487 parts In-Stock

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Glotronic Ltd.

UK . 9,600 parts In-Stock

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Kulean Microsystems

USA . 8,133 parts In-Stock

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TANS Electronics

Latvia . 7,256 parts In-Stock

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Problanco Electronics

Mexico . 7,133 parts In-Stock

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Kepictronics

USA . 4,135 parts In-Stock

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Argo Parts USA

USA . 3,807 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 2,418 parts In-Stock

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Lucentia Tech

USA . 2,418 parts In-Stock

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$16.972

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$16.625

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$16.625

2,418

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$16.625

$16.625

Continental Prestige Electronics

USA . 1,440 parts In-Stock

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SupplyDigital Components

Austria . 1,200 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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560

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Futuretech Components

Singapore . 155 parts In-Stock

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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50

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Overview

Experience the superior quality of Onsemi with the NLV27WZ07DFT2G Logic Gates. With a cutting-edge design and AEC-Q101 screening level, this product offers unmatched reliability and performance. Ideal for a wide range of applications, including automotive and industrial electronics, this Logic Gate provides a fast propagation delay of 4.8 ns, ensuring efficient operation. Trust in Onsemi's reputation for excellence and invest in a product that delivers exceptional value and benefits to customers looking for high-quality components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product.

Propagation Delay At Nominal Supply: 4.8 ns

Fast propagation delay ensures efficient processing of signals.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards.

No. of Functions: 2

Having 2 functions in one device increases efficiency and reduces space usage in a circuit.

Nominal Supply Voltage / Vsup (V): 2.3

Low nominal supply voltage reduces power consumption.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for easy interfacing with other devices.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Technical Specifications

Logic Gates NLV27WZ07DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

27WZ

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.1 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q101

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV27WZ07DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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