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NLV27WZ04DFT2G

Onsemi

NLV27WZ04DFT2G by Onsemi

NLV27WZ04DFT2G by Onsemi is a CMOS Logic Gate with 5ns Propagation Delay, suitable for military applications. It operates at 3.3V with 2 functions and a load capacitance of 50pF. This surface-mount device has a max operating temperature of 125°C and AEC-Q100 screening level.

Median Price

$0.294

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Arrow

USA . 3,000 parts In-Stock

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$0.179

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DigiKey

USA . 621 parts In-Stock

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$1.030

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$0.390

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$0.303

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621

$1.030

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Chip1Stop

Japan . 3,000 parts In-Stock

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$2.580

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$0.717

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$0.487

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3,000

$2.580

$0.717

$0.487

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Element14

Singapore . 3,923 parts In-Stock

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$0.350

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$0.259

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$0.247

3,923

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$0.350

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$0.247

Farnell

UK . 3,108 parts In-Stock

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$0.237

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$0.159

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$0.157

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$0.237

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$0.157

Future Electronics

Canada . 3,000 parts In-Stock

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$0.173

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Mouser Electronics

USA . 1,745 parts In-Stock

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$0.227

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Verical

USA . 365 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,510 parts In-Stock

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$0.237

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$0.237

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Nova Conductors

Japan . 20 parts In-Stock

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Chip Stock

USA . 67,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 15,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 8,905 parts In-Stock

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Flip Electronics

USA . 7,100 parts In-Stock

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Vyrian

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Prism Electronics

USA . 441 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,377 parts In-Stock

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$0.147

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$0.147

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Semicontronic

India . 2,339 parts In-Stock

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$0.147

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$0.143

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$0.143

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2,339

$0.147

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$0.143

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Corohmni

South Africa . 333 parts In-Stock

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$0.173

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333

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Corphita

USA . 668 parts In-Stock

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$0.224

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Argo Parts USA

USA . 4,872 parts In-Stock

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$0.271

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$0.263

4,872

$0.271

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$0.263

Netroflash

USA . 1,000 parts In-Stock

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$0.271

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$0.266

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$0.271

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Vigor

Singapore . 494 parts In-Stock

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$0.640

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Microchip USA

USA . 4,089 parts In-Stock

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$1.585

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Advanced Electronics

New Zealand . 71 parts In-Stock

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$14.126

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$12.855

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$11.583

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Aztec Data Supply Inc.

USA . 249 parts In-Stock

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$31.700

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Perfect Parts

USA . 257,365 parts In-Stock

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GreenTree Electronics

Israel . 183,000 parts In-Stock

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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ChipstoGo Electronic ltd

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Kepictronics

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SupplyDigital Components

Austria . 8,377 parts In-Stock

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Lixinc

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Kulean Microsystems

USA . 6,650 parts In-Stock

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Problanco Electronics

Mexico . 6,412 parts In-Stock

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Continental Prestige Electronics

USA . 4,443 parts In-Stock

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$0.232

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$0.164

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TANS Electronics

Latvia . 3,214 parts In-Stock

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iodParts Technologies Inc.

India . 2,635 parts In-Stock

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Glotronic Ltd.

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UHIMA Technologies

Türkiye . 869 parts In-Stock

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Overview

Discover the NLV27WZ04DFT2G by Onsemi, a top-quality logic gate designed to deliver reliable performance in a wide range of applications. Manufactured by Onsemi, a trusted name in the industry, this product offers customers unmatched value and benefits. With a low propagation delay, small outline package style, and military-grade temperature rating, this logic gate is perfect for demanding environments where precision and efficiency are crucial. Trust Onsemi's expertise and choose the NLV27WZ04DFT2G for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 5 ns

Low propagation delay allows for fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Ease of installation and compact design make this product ideal for space-constrained applications.

No. of Functions: 2

Having multiple functions in one component saves space on the circuit board and simplifies the overall design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board and enables easy integration into existing systems.

Nominal Supply Voltage / Vsup (V): 2.3

Suitable operating voltage for a wide range of applications, providing flexibility in design and compatibility with different systems.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal processing and stability in the circuit.

Power Supplies (V): 3.3

Compatible with standard power supplies, making integration into existing systems easy and convenient.

No. of Terminals: 6

Sufficient number of terminals for connectivity options while maintaining a compact form factor.

Maximum I (ol): 24 Amp

High output current capability allows for driving a variety of loads, expanding the range of applications for this product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Logic Gates NLV27WZ04DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV27WZ04DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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