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NLV27WZU04DFT2G

Onsemi

NLV27WZU04DFT2G by Onsemi

NLV27WZU04DFT2G by Onsemi is a CMOS Logic Gate with 7ns Propagation Delay, suitable for military applications. It operates at 1.8V nominal voltage and has a max operating temperature of 125 °C. This dual-terminal device comes in a small outline package with thin profile, ideal for high-speed circuit designs.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,680 parts In-Stock

1+ parts

$2.630

100+ parts

$0.867

1k+ parts

$0.582

10k+ parts

-

2,680

$2.630

$0.867

$0.582

-

Arrow

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.300

10k+ parts

$0.270

6,000

-

-

$0.300

$0.270

Verical

USA . 6,000 parts In-Stock

1+ parts

-

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1k+ parts

$0.300

10k+ parts

$0.270

6,000

-

-

$0.300

$0.270

Distributors (In-Stock)

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Digiode

USA . 1,182 parts In-Stock

1+ parts

$2.498

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-

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1,182

$2.498

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Flip Electronics

USA . 945,303 parts In-Stock

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945,303

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Vyrian

USA . 4,101 parts In-Stock

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4,101

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Distributors (Availability)

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$0.300

100+ parts

-

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172

$0.300

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Vigor

Singapore . 363 parts In-Stock

1+ parts

$0.310

100+ parts

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363

$0.310

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Component Stockers USA

USA . 16,607 parts In-Stock

1+ parts

$0.740

100+ parts

$0.470

1k+ parts

$0.370

10k+ parts

-

16,607

$0.740

$0.470

$0.370

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Corphita

USA . 216 parts In-Stock

1+ parts

$2.367

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216

$2.367

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Microchip USA

USA . 3,996 parts In-Stock

1+ parts

$5.655

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3,996

$5.655

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AZTECH Wire

Italy . 1,029 parts In-Stock

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$16.950

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1,029

$16.950

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SupplyDigital Components

Austria . 5,035 parts In-Stock

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5,035

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TANS Electronics

Latvia . 4,936 parts In-Stock

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Problanco Electronics

Mexico . 4,268 parts In-Stock

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GreenTree Electronics

Israel . 2,980 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kulean Microsystems

USA . 864 parts In-Stock

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864

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Perfect Parts

USA . 560 parts In-Stock

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560

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UHIMA Technologies

Türkiye . 498 parts In-Stock

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498

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Overview

Elevate your electronic designs with the NLV27WZU04DFT2G by Onsemi, a top-tier manufacturer known for delivering high-quality Logic Gates. This versatile component offers a fast propagation delay, dual functions, and AEC-Q100 screening level, making it ideal for a wide range of applications. With its small outline and thin profile package style, this product provides exceptional performance while saving space in your projects. Trust Onsemi's reputation for excellence and invest in the NLV27WZU04DFT2G to take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 7 ns

With a low propagation delay of 7 ns at nominal supply voltage, these logic gates offer fast signal processing and response times.

Surface Mount: YES

The surface mount capability makes installation and integration of the logic gates easier and more convenient in various electronic circuits and devices.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a nominal supply voltage of 1.8V allows for efficient power consumption and compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, these logic gates can withstand high temperature environments and ensure reliable performance under varying conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications in digital electronics.

Technical Specifications

Logic Gates NLV27WZU04DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

NLV27WZU04DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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