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NLV18SZ125DFT2G

Onsemi

NLV18SZ125DFT2G by Onsemi

NLV18SZ125DFT2G by Onsemi is a CMOS Logic Gate with 7.5ns Propagation Delay, 50pF Load Capacitance, and 24A Max I (ol). Ideal for military applications due to its AEC-Q100 Screening Level and -55 to 125 °C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,630 parts In-Stock

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Digiode

USA . 2,303 parts In-Stock

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Vigor

Singapore . 226 parts In-Stock

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AZTECH Wire

Italy . 1,079 parts In-Stock

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Kulean Microsystems

USA . 7,902 parts In-Stock

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Problanco Electronics

Mexico . 7,846 parts In-Stock

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TANS Electronics

Latvia . 5,054 parts In-Stock

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Corphita

USA . 2,150 parts In-Stock

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SupplyDigital Components

Austria . 870 parts In-Stock

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UHIMA Technologies

Türkiye . 464 parts In-Stock

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Corohmni

South Africa . 199 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the NLV18SZ125DFT2G by Onsemi, a top-quality logic gate that offers reliable performance and precision. Manufactured by Onsemi, a trusted name in the industry known for innovation and excellence, this logic gate is perfect for a wide range of applications. With fast propagation delays and low power consumption, this product provides exceptional value and efficiency to customers. Whether you're working on automotive electronics or industrial controls, this logic gate will help simplify your designs and improve overall functionality. Trust Onsemi's expertise and choose the NLV18SZ125DFT2G for all your logic gate needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and ability to protect the internal components of the logic gate.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast performance and responsiveness of the logic gate, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the logic gate onto a circuit board, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures that the logic gate meets automotive industry quality and reliability requirements, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 2.3

The specific supply voltage of 2.3V ensures compatibility with a wide range of systems and circuits, making this logic gate versatile in various applications.

Technical Specifications

Logic Gates NLV18SZ125DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

15.6 ns

Schmitt Trigger:

NO

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV18SZ125DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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