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NLSX5014DTR2G

Onsemi

NLSX5014DTR2G by Onsemi

NLSX5014DTR2G by Onsemi is a small outline interface IC with 14 terminals. It operates in a temperature range of -55 to 125°C and has a supply voltage range of 0.9V to 4.5V, making it suitable for military-grade applications requiring precise signal interfacing.

Median Price

$1.640

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,640 parts In-Stock

1+ parts

$1.100

100+ parts

$1.030

1k+ parts

$0.931

10k+ parts

-

4,640

$1.100

$1.030

$0.931

-

Chip1Stop

Japan . 29 parts In-Stock

1+ parts

$1.640

100+ parts

-

1k+ parts

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29

$1.640

-

-

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Verical

USA . 274 parts In-Stock

1+ parts

$2.004

100+ parts

$1.408

1k+ parts

-

10k+ parts

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274

$2.004

$1.408

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Arrow

USA . 274 parts In-Stock

1+ parts

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274

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Distributors (In-Stock)

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Digiode

USA . 1,995 parts In-Stock

1+ parts

$1.045

100+ parts

-

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1,995

$1.045

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Flip Electronics

USA . 299,311 parts In-Stock

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299,311

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-

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Vyrian

USA . 8,103 parts In-Stock

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8,103

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Chip Stock

USA . 4,000 parts In-Stock

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4,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,291 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

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2,291

$0.990

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-

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

$1.100

100+ parts

-

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376

$1.100

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Vigor

Singapore . 210 parts In-Stock

1+ parts

$1.250

100+ parts

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210

$1.250

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Component Stockers USA

USA . 3,982 parts In-Stock

1+ parts

$2.160

100+ parts

$1.460

1k+ parts

$0.990

10k+ parts

-

3,982

$2.160

$1.460

$0.990

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AZTECH Wire

Italy . 1,058 parts In-Stock

1+ parts

$18.120

100+ parts

-

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1,058

$18.120

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Microchip USA

USA . 192 parts In-Stock

1+ parts

$71.070

100+ parts

$70.450

1k+ parts

$70.450

10k+ parts

$69.830

192

$71.070

$70.450

$70.450

$69.830

Lixinc

USA . 16,128 parts In-Stock

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16,128

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SupplyDigital Components

Austria . 8,054 parts In-Stock

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8,054

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Kulean Microsystems

USA . 4,449 parts In-Stock

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4,449

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Problanco Electronics

Mexico . 3,469 parts In-Stock

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3,469

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TANS Electronics

Latvia . 3,107 parts In-Stock

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3,107

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Continental Prestige Electronics

USA . 2,688 parts In-Stock

1+ parts

-

100+ parts

$0.954

1k+ parts

$0.743

10k+ parts

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2,688

-

$0.954

$0.743

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UHIMA Technologies

Türkiye . 836 parts In-Stock

1+ parts

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100+ parts

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836

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Overview

Elevate your electronic designs with the NLSX5014DTR2G by Onsemi. Crafted with precision and expertise, this interface circuit IC offers unmatched quality and reliability. Designed for a wide range of applications, this product provides seamless connectivity and efficient performance. Experience the value and benefits of this small outline package that delivers superior functionality, making it the ideal choice for your projects. Trust in Onsemi to bring innovation and excellence to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material helps in reducing the overall weight of the product, making it suitable for applications where weight is a critical factor.

Surface Mount: YES

The surface mount feature allows for easy installation and replacement of the IC, making it convenient for manufacturing and maintenance processes.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into circuit boards and allows for efficient use of space in electronic designs.

No. of Terminals: 14

The 14 terminals provide multiple connection points for interfacing with other components, allowing for complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in miniaturizing the overall size of the IC, making it suitable for compact electronic devices.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage ensures efficient power consumption, helping in saving energy and prolonging battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to function reliably in industrial and automotive environments where temperatures can fluctuate.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enables the IC to withstand extreme cold conditions, making it suitable for outdoor and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish ensures excellent conductivity and corrosion resistance, enhancing the overall reliability of the connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit configurations and ensures secure connections for reliable performance.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables the IC to be used in slim and space-constrained devices without compromising on functionality.

Width: 4.4 mm

The compact width of 4.4 mm contributes to the small form factor of the IC, making it ideal for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps in preventing thermal damage during soldering processes, ensuring the longevity of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering of the IC to the circuit board, ensuring a secure and durable connection.

Length: 5 mm

The length of 5 mm contributes to the overall compactness of the IC, making it suitable for applications where size is a critical factor.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the IC can withstand harsh environmental conditions and operate reliably in rugged settings.

Terminal Form: GULL WING

The gull wing terminal form provides a strong mechanical connection and facilitates easy soldering, enhancing the overall durability and reliability of the IC.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a commonly used voltage level in electronics, ensuring compatibility with a wide range of systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting of the IC on circuit boards, maximizing space efficiency in electronic designs.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type of the IC enables seamless communication and data exchange between different components, making it essential for various electronic systems.

Technical Specifications

Other Function Interface ICs NLSX5014DTR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLSX5014DTR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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