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NLSX0102FCT2G

Onsemi

NLSX0102FCT2G by Onsemi

NLSX0102FCT2G by Onsemi is a surface mount IC with 8 terminals and 2 functions. It operates b/w -40 to 85 °C, with a supply voltage range of 1.5V to 5.5V. Ideal for industrial applications requiring interface circuitry in compact spaces.

Median Price

$0.614

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,250 parts In-Stock

1+ parts

$1.030

100+ parts

$0.593

1k+ parts

$0.513

10k+ parts

-

1,250

$1.030

$0.593

$0.513

-

Rochester

USA . 2,010,770 parts In-Stock

1+ parts

-

100+ parts

$0.591

1k+ parts

$0.491

10k+ parts

$0.438

2,010,770

-

$0.591

$0.491

$0.438

Verical

USA . 1,306,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.614

10k+ parts

$0.547

1,306,910

-

-

$0.614

$0.547

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,738 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

-

10k+ parts

-

1,738

$0.461

-

-

-

Vyrian

USA . 1,213 parts In-Stock

1+ parts

$0.485

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

$0.485

-

-

-

Speed Components Ltd

Israel . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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550

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,106,507 parts In-Stock

1+ parts

$0.412

100+ parts

-

1k+ parts

-

10k+ parts

-

1,106,507

$0.412

-

-

-

Corphita

USA . 305 parts In-Stock

1+ parts

$0.436

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$0.436

-

-

-

Corohmni

South Africa . 393 parts In-Stock

1+ parts

$0.485

100+ parts

-

1k+ parts

-

10k+ parts

-

393

$0.485

-

-

-

Vigor

Singapore . 430 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$0.890

-

-

-

Microchip USA

USA . 4,568 parts In-Stock

1+ parts

$3.366

100+ parts

-

1k+ parts

-

10k+ parts

-

4,568

$3.366

-

-

-

Authorized Procurement Solutions

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,000

-

-

-

-

Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,000

-

-

-

-

Kulean Microsystems

USA . 7,376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,376

-

-

-

-

Lixinc

USA . 6,267 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,267

-

-

-

-

Problanco Electronics

Mexico . 4,213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,213

-

-

-

-

TANS Electronics

Latvia . 4,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,104

-

-

-

-

SupplyDigital Components

Austria . 3,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,876

-

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,700

-

-

-

-

UHIMA Technologies

Türkiye . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

332

-

-

-

-

Overview

Discover the innovative NLSX0102FCT2G by Onsemi, a top-quality interface IC that is revolutionizing the industry. With a focus on performance and reliability, Onsemi delivers cutting-edge solutions for various applications. This product offers exceptional value, providing customers with efficiency and ease of use. Experience the advantages of this advanced technology and elevate your projects to new heights with Onsemi's NLSX0102FCT2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various operating environments.

Surface Mount: YES

Being surface mountable allows for easy integration into PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage allows for versatility in power source options, making it compatible with a wide range of systems.

No. of Functions: 2

Having multiple functions in one IC saves board space and simplifies system design, making it a cost-effective solution.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easily mountable, providing compatibility with standard PCB layouts.

No. of Terminals: 8

Having a moderate number of terminals allows for necessary connections without being too complex, ensuring ease of use.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers compactness and high density, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.5 V

Low minimum supply voltage enhances energy efficiency and allows operation in low-power scenarios, saving power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environmental conditions, increasing overall product durability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature extends the range of operating environments in which the product can be used, improving versatility.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and improves signal integrity, enhancing overall system performance.

Maximum Seated Height: 0.5 mm

Low maximum seated height reduces the overall profile of the component, allowing for compact and sleek device designs.

Width: 0.9 mm

Narrow width saves space on the PCB, enabling more components to be placed in a limited area.

Maximum Time At Peak Reflow Temperature (s): 30

A short time at peak reflow temperature reduces the risk of thermal damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables soldering in lead-free processes, meeting environmental regulations and industry standards.

Length: 1.9 mm

Compact length contributes to overall space-saving design, making the product suitable for applications with limited board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments, enhancing product durability.

Terminal Form: BALL

Ball terminal form provides reliable connections and allows for easy rework, making the product user-friendly during maintenance.

Nominal Supply Voltage: 3.3 V

A stable nominal supply voltage ensures consistent performance in various operating conditions, enhancing overall system reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, maximizing board space utilization and improving design flexibility.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication between different components or systems, expanding its compatibility and usability.

Technical Specifications

Other Function Interface ICs NLSX0102FCT2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B8

JESD-609 Code:

e1

Length:

1.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.9 mm

Trade Compliance

NLSX0102FCT2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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