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NLSX5011AMUTAG

Onsemi

NLSX5011AMUTAG by Onsemi

NLSX5011AMUTAG by Onsemi is a small outline, very thin profile interface IC with 6 terminals. It operates b/w -55 to 125 °C and supports supply voltage range of 0.9V to 4.5V. Ideal for military-grade applications requiring nickel palladium gold finish and dual terminal position.

Median Price

$0.788

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,368 parts In-Stock

1+ parts

$1.290

100+ parts

$0.751

1k+ parts

$0.654

10k+ parts

$0.560

1,368

$1.290

$0.751

$0.654

$0.560

Flip Electronics (Authorized)

USA . 116,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116,705

-

-

-

-

Rochester

USA . 93,000 parts In-Stock

1+ parts

-

100+ parts

$0.759

1k+ parts

$0.630

10k+ parts

$0.562

93,000

-

$0.759

$0.630

$0.562

Verical

USA . 93,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.788

10k+ parts

$0.703

93,000

-

-

$0.788

$0.703

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 476 parts In-Stock

1+ parts

$0.592

100+ parts

-

1k+ parts

-

10k+ parts

-

476

$0.592

-

-

-

Vyrian

USA . 2,309 parts In-Stock

1+ parts

$0.623

100+ parts

-

1k+ parts

-

10k+ parts

-

2,309

$0.623

-

-

-

Flip Electronics

USA . 116,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116,705

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 424 parts In-Stock

1+ parts

$0.440

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$0.440

-

-

-

Corphita

USA . 2,221 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

-

10k+ parts

-

2,221

$0.561

-

-

-

Corohmni

South Africa . 442 parts In-Stock

1+ parts

$0.623

100+ parts

-

1k+ parts

-

10k+ parts

-

442

$0.623

-

-

-

Microchip USA

USA . 1,769 parts In-Stock

1+ parts

$4.325

100+ parts

-

1k+ parts

-

10k+ parts

-

1,769

$4.325

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,788 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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27,788

-

-

-

-

Perfect Parts

USA . 15,120 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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15,120

-

-

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TANS Electronics

Latvia . 6,454 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,454

-

-

-

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Problanco Electronics

Mexico . 3,682 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,682

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-

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Kulean Microsystems

USA . 1,375 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,375

-

-

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UHIMA Technologies

Türkiye . 648 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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648

-

-

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SupplyDigital Components

Austria . 68 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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68

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-

Overview

Discover the NLSX5011AMUTAG by Onsemi, a top-of-the-line Other Function Interface IC that sets the standard for quality and reliability. Manufactured with precision and expertise, this product is designed to exceed expectations in various applications. With a compact design and advanced features, this interface circuit offers customers unparalleled value and benefits. Whether you're looking for optimal performance or seamless integration, the NLSX5011AMUTAG delivers on all fronts, making it the ideal choice for your next project. Unleash the power of innovation with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to environmental factors, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 4.5 V

High maximum supply voltage tolerance enables compatibility with a wide range of power sources, increasing flexibility in application.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement and mounting within electronic devices, optimizing space utilization.

No. of Terminals: 6

Having 6 terminals provides sufficient connection points for versatile usage and connectivity options.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and thin profile design enhances compactness and efficiency in circuit board layout and overall device size.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage requirement allows for operation in low-power conditions, conserving energy and optimizing battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows for usage in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers superior conductivity and corrosion resistance, ensuring stable and efficient electrical connections.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connection, reducing the risk of signal loss or disconnection.

Maximum Seated Height: 0.55 mm

Low seated height allows for slim and compact device design, enhancing flexibility in product integration and layout.

Width: 1 mm

Narrow width dimension enables space-saving installation, ideal for applications with limited board space.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with optimized timeframe ensures proper soldering of the component onto the PCB, reducing manufacturing time.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering without component damage, ensuring quality assembly.

Length: 1.45 mm

Compact length dimension facilitates easy integration and placement, ideal for devices with space constraints.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure ruggedness and reliability in harsh operating environments, suitable for demanding applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes eco-friendly manufacturing practices.

Nominal Supply Voltage: 2.8 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting, enabling efficient use of board space and optimized connectivity.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface IC type indicates the product's specific function in enabling communication or data exchange between different components, enhancing device functionality.

Technical Specifications

Other Function Interface ICs NLSX5011AMUTAG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Additional Features:

CONFIGURABLE INTERFACE STANDARDS

Interface IC Type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLSX5011AMUTAG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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