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NLSX5011AMUTBG

Onsemi

NLSX5011AMUTBG by Onsemi

NLSX5011AMUTBG by Onsemi is a dual-function interface IC with a supply voltage range of 0.9V to 4.5V, suitable for military-grade applications. It features a small outline package style, nickel/palladium/gold terminal finish, and operates in temperatures ranging from -55 °C to 125°C. Ideal for surface mount designs requiring compact and reliable interface circuitry.

Median Price

$0.950

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,950 parts In-Stock

1+ parts

$0.950

100+ parts

$0.538

1k+ parts

$0.465

10k+ parts

$0.407

2,950

$0.950

$0.538

$0.465

$0.407

Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 676 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

-

10k+ parts

-

676

$1.634

-

-

-

Vyrian

USA . 2,318 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,318

$1.720

-

-

-

Flip Electronics

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,921 parts In-Stock

1+ parts

$1.030

100+ parts

$0.670

1k+ parts

$0.440

10k+ parts

-

1,921

$1.030

$0.670

$0.440

-

Corphita

USA . 1,316 parts In-Stock

1+ parts

$1.548

100+ parts

-

1k+ parts

-

10k+ parts

-

1,316

$1.548

-

-

-

Corohmni

South Africa . 494 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$1.720

-

-

-

Microchip USA

USA . 4,194 parts In-Stock

1+ parts

$3.038

100+ parts

-

1k+ parts

-

10k+ parts

-

4,194

$3.038

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,663 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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18,663

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Problanco Electronics

Mexico . 5,901 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,901

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-

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TANS Electronics

Latvia . 4,857 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,857

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-

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SupplyDigital Components

Austria . 3,657 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,657

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UHIMA Technologies

Türkiye . 977 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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977

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Kulean Microsystems

USA . 923 parts In-Stock

1+ parts

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100+ parts

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923

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Overview

Discover the NLSX5011AMUTBG by Onsemi, a high-quality Other Function Interface IC designed to meet the demands of various applications. Onsemi, known for their top-notch manufacturing standards, has crafted this product with precision and reliability in mind. With its compact design and versatile functions, this IC offers unparalleled value to customers looking for superior performance in a wide range of electronic devices. Trust Onsemi's expertise and choose the NLSX5011AMUTBG for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC and EPOXY materials provide durability and reliability, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 4.5 V

With a maximum supply voltage of 4.5V, this product can handle higher voltage levels, providing flexibility in design and compatibility with different power sources.

No. of Functions: 2

Having multiple functions in one IC allows for integration of different features in a compact design, saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and mount, contributing to efficient manufacturing processes.

No. of Terminals: 6

The 6 terminals provide multiple connection points, enabling versatile connectivity options in the circuit layout.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and very thin profile of the package save space on the PCB, making it suitable for compact electronic devices.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage of 0.9V allows for operation in low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this IC can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures functionality in extreme cold environments, increasing the product's versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: DUAL

Having dual terminal positions allows for more stable and secure connections, preventing signal loss or interference.

Maximum Seated Height: 0.55 mm

The low maximum seated height of 0.55mm helps in reducing the overall profile of the circuit board, especially in slim electronic devices.

Width: 1 mm

The compact width of 1mm contributes to a space-saving design, ideal for applications with limited PCB real estate.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and mounting of the IC onto the PCB, enhancing overall product reliability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the IC can withstand high-temperature soldering processes without any degradation in performance.

Length: 1.45 mm

The compact length of 1.45mm allows for a smaller footprint on the circuit board, leading to efficient space utilization.

Temperature Grade: MILITARY

Being military-grade ensures that the IC meets stringent quality and reliability standards, making it suitable for demanding applications in harsh environments.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and RoHS compliant, promoting sustainability and compatibility with modern regulations.

Nominal Supply Voltage: 2.8 V

With a nominal supply voltage of 2.8V, the IC can operate efficiently within a typical voltage range, ensuring stable performance.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling compact and space-efficient designs.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication between different components or systems, enhancing the overall functionality of electronic devices.

Technical Specifications

Other Function Interface ICs NLSX5011AMUTBG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Additional Features:

CONFIGURABLE INTERFACE STANDARDS

Interface IC Type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NLSX5011AMUTBG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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