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NLSX5004MN1TXG

Onsemi

NLSX5004MN1TXG by Onsemi

NLSX5004MN1TXG by Onsemi is a 14-terminal interface IC with a max supply voltage of 4.5V and min of 0.9V. It operates in temperatures ranging from -40 to 125 °C, making it suitable for automotive applications requiring a compact chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,588 parts In-Stock

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Vyrian

USA . 1,387 parts In-Stock

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Kulean Microsystems

USA . 6,985 parts In-Stock

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Problanco Electronics

Mexico . 2,496 parts In-Stock

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Corphita

USA . 878 parts In-Stock

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TANS Electronics

Latvia . 486 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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SupplyDigital Components

Austria . 234 parts In-Stock

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UHIMA Technologies

Türkiye . 59 parts In-Stock

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Overview

Enhance your electronic designs with the NLSX5004MN1TXG by Onsemi. Known for their superior quality and reliability, Onsemi offers cutting-edge products that meet the highest industry standards. This interface circuit IC is perfect for a wide range of applications, delivering seamless performance and precision. With a compact square package design and automotive-grade temperature grade, this product ensures optimal functionality in any setting. Elevate your projects with the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mounting simplifies the installation process and saves space on the circuit board.

Maximum Supply Voltage: 4.5 V

Can operate at relatively high voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board.

No. of Terminals: 14

Sufficient number of terminals for connectivity with other components in the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of styles provides efficient heat dissipation and a compact form factor.

Minimum Supply Voltage: 0.9 V

Can operate at low voltages, making it energy-efficient and versatile.

Maximum Operating Temperature: 125 °C

Can perform reliably in high-temperature environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring reliability in a variety of environments.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection to other components.

Maximum Seated Height: 1 mm

Low profile design saves space on the circuit board and allows for compact device designs.

Width: 3.5 mm

Narrow width facilitates integration into tight spaces on the circuit board.

Length: 3.5 mm

Compact length also contributes to space-saving on the circuit board.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature tolerance and durability.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces the risk of harmful substances in the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the circuit board, increasing connectivity options.

Interface IC Type: INTERFACE CIRCUIT

Specialized for interface circuits, ensuring optimal performance in communication between different components.

Technical Specifications

Other Function Interface ICs NLSX5004MN1TXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N14

Length:

3.5 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

NLSX5004MN1TXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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