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NLSX4302EBMUTCG

Onsemi

NLSX4302EBMUTCG by Onsemi

NLSX4302EBMUTCG by Onsemi is a surface mount IC with 2 functions, operating voltage range of 1.5V to 5.5V, and package style of very thin profile chip carrier. It is an interface circuit suitable for applications requiring low power consumption and compact design in temperature-sensitive environments.

Median Price

$0.861

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,000 parts In-Stock

1+ parts

$0.861

100+ parts

$0.561

1k+ parts

$0.428

10k+ parts

$0.377

9,000

$0.861

$0.561

$0.428

$0.377

DigiKey

USA . 2,761 parts In-Stock

1+ parts

$0.980

100+ parts

$0.559

1k+ parts

$0.483

10k+ parts

$0.409

2,761

$0.980

$0.559

$0.483

$0.409

Chip1Stop

Japan . 2,890 parts In-Stock

1+ parts

$3.550

100+ parts

$1.100

1k+ parts

$0.774

10k+ parts

-

2,890

$3.550

$1.100

$0.774

-

Rochester

USA . 998,560 parts In-Stock

1+ parts

-

100+ parts

$0.555

1k+ parts

$0.460

10k+ parts

$0.410

998,560

-

$0.555

$0.460

$0.410

Verical

USA . 998,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.576

10k+ parts

$0.513

998,560

-

-

$0.576

$0.513

Flip Electronics (Authorized)

USA . 321,891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321,891

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,302 parts In-Stock

1+ parts

$0.432

100+ parts

-

1k+ parts

-

10k+ parts

-

1,302

$0.432

-

-

-

Vyrian

USA . 2,096 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

-

2,096

$0.455

-

-

-

Flip Electronics

USA . 321,891 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321,891

-

-

-

-

Cyclops Electronics Ltd

UK . 18,958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18,958

-

-

-

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Prism Electronics

USA . 3,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,225

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 274 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$0.410

-

-

-

Corohmni

South Africa . 166 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$0.455

-

-

-

Component Stockers USA

USA . 1,441,175 parts In-Stock

1+ parts

$0.470

100+ parts

$0.440

1k+ parts

$0.400

10k+ parts

$0.400

1,441,175

$0.470

$0.440

$0.400

$0.400

Microchip USA

USA . 100 parts In-Stock

1+ parts

$4.620

100+ parts

$4.600

1k+ parts

$4.600

10k+ parts

$4.590

100

$4.620

$4.600

$4.600

$4.590

Perfect Parts

USA . 228,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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228,939

-

-

-

-

Kepictronics

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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36,000

-

-

-

-

Lixinc

USA . 9,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,715

-

-

-

-

SupplyDigital Components

Austria . 7,657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,657

-

-

-

-

TANS Electronics

Latvia . 6,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,425

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,296

-

-

-

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Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

-

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iodParts Technologies Inc.

India . 2,188 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,188

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-

-

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Problanco Electronics

Mexico . 1,256 parts In-Stock

1+ parts

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100+ parts

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1,256

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-

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Kulean Microsystems

USA . 372 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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372

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-

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UHIMA Technologies

Türkiye . 276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

276

-

-

-

-

Overview

Discover the NLSX4302EBMUTCG by Onsemi, a cutting-edge Other Function Interface IC that brings superior quality and reliability to your projects. Manufactured by industry leader Onsemi, this innovative product offers a range of applications, from consumer electronics to industrial automation. With its compact size and advanced technology, the NLSX4302EBMUTCG provides unmatched value and performance, making it the perfect choice for customers looking for seamless integration and optimal functionality in their designs. Elevate your projects with the NLSX4302EBMUTCG and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient integration into electronic circuits, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

Support for high supply voltage ensures compatibility with a wide range of applications and provides flexibility in circuit design.

No. of Functions: 2

Having multiple functions in a single IC can simplify circuit design, reduce component count, and improve overall system efficiency.

Package Shape: RECTANGULAR

Rectangular package shape is standardized and easy to handle, making it suitable for automated assembly processes.

Power Supplies (V): 1.8/5

Support for multiple power supply options allows for compatibility with various voltage levels in different systems.

No. of Terminals: 8

Having a sufficient number of terminals enables connectivity with other components and peripherals, enhancing the versatility of the IC.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier package with a very thin profile saves space on the circuit board and enables compact, slim device designs.

Minimum Supply Voltage: 1.5 V

Support for low supply voltage ensures efficient power consumption, making the IC suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the IC to function in extreme cold conditions, increasing its usability in various applications.

Terminal Finish: NICKEL SILVER GOLD PALLADIUM

Terminal finish with multiple materials provides corrosion resistance, reliable electrical contact, and longevity for the IC.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and inspection during assembly processes, improving manufacturing efficiency.

Maximum Seated Height: 0.55 mm

Low seated height allows for slim and compact device designs, which is essential for portable and space-constrained applications.

Width: 1.2 mm

Narrow width enables close placement of components on the circuit board, optimizing space utilization and enhancing overall system compactness.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on the IC during the manufacturing process, ensuring product reliability and consistency.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering processes, ensuring strong and durable connections with the PCB.

Length: 1.4 mm

Compact length contributes to the overall small form factor of the IC, enabling the creation of sleek and portable electronic devices.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainability in electronic manufacturing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, simplifying system integration.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting, enabling more functions to be packed in a limited space, enhancing design flexibility.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit IC, this product offers specialized functionality for connecting various components and systems seamlessly.

Technical Specifications

Other Function Interface ICs NLSX4302EBMUTCG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-XQCC-N8

Length:

1.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.05X.06,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL SILVER GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

NLSX4302EBMUTCG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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