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NLSX5011AMX1TCG

Onsemi

NLSX5011AMX1TCG by Onsemi

NLSX5011AMX1TCG by Onsemi is a 6-terminal interface IC with a max supply voltage of 4.5V and min of 0.9V. It features a grid array package style, suitable for military-grade applications requiring an operating temperature range from -55 °C to 125°C.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,910 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

2,910

$0.160

-

-

-

Rochester

USA . 5,796 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

5,796

-

$0.396

$0.329

$0.293

Verical

USA . 5,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.411

10k+ parts

$0.367

5,796

-

-

$0.411

$0.367

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,755 parts In-Stock

1+ parts

$0.152

100+ parts

-

1k+ parts

-

10k+ parts

-

1,755

$0.152

-

-

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Vyrian

USA . 7,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,630

-

-

-

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Sensible Micro Corp

USA . 2,910 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,910

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,451 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

-

10k+ parts

-

1,451

$0.144

-

-

-

Corohmni

South Africa . 490 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

-

490

$0.160

-

-

-

Vigor

Singapore . 609 parts In-Stock

1+ parts

$0.310

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$0.310

-

-

-

AZTECH Wire

Italy . 687 parts In-Stock

1+ parts

$14.020

100+ parts

-

1k+ parts

-

10k+ parts

-

687

$14.020

-

-

-

Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$17.531

100+ parts

$15.953

1k+ parts

$14.375

10k+ parts

-

16

$17.531

$15.953

$14.375

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,000

-

-

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SupplyDigital Components

Austria . 6,939 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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6,939

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Continental Prestige Electronics

USA . 5,796 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.288

10k+ parts

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5,796

-

-

$0.288

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Problanco Electronics

Mexico . 3,069 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,069

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TANS Electronics

Latvia . 2,351 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,351

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Kulean Microsystems

USA . 1,878 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,878

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Microchip USA

USA . 243 parts In-Stock

1+ parts

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100+ parts

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243

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UHIMA Technologies

Türkiye . 135 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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135

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Overview

Unlock the potential of your electronic devices with the NLSX5011AMX1TCG by Onsemi. Known for their superior quality and innovative technology, Onsemi delivers cutting-edge solutions in the category of Other Function Interface ICs. This product boasts a wide range of applications and offers customers unparalleled value and benefits. Whether you're looking to enhance the performance of your electronics or improve operational efficiency, the NLSX5011AMX1TCG is the perfect choice. Experience the difference with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage capability ensures compatibility with a variety of power sources, increasing the versatility of the product.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on circuit boards, enabling compact and streamlined designs.

No. of Terminals: 6

Having 6 terminals provides ample connection points for interfacing with other components, enhancing the functionality of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offer high density and precise connections, optimizing performance in a compact form factor.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage requirement allows for operation in energy-efficient systems, reducing power consumption and costs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain reliable performance under heat stress.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures operation in extreme cold environments, making the product suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections over an extended lifespan.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy access and soldering during installation, simplifying the assembly process.

Maximum Seated Height: 0.4 mm

The low maximum seated height contributes to a slim profile and space-saving design, ideal for compact devices and applications with limited space.

Width: 1 mm

The narrow width of 1 mm allows for efficient placement and routing on circuit boards, enabling compact and streamlined layouts.

Length: 1.2 mm

The short length of 1.2 mm enhances the overall compactness of the product, making it suitable for small-scale applications and space-constrained designs.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in demanding conditions and critical applications, offering superior performance and durability.

Terminal Form: BUTT

The butt terminal form provides a sturdy and secure connection, minimizing the risk of disconnection and ensuring long-term reliability in operation.

Nominal Supply Voltage: 2.8 V

The nominal supply voltage of 2.8 V offers a stable power input for consistent performance, enhancing the efficiency and reliability of the product.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4 mm allows for high-density mounting and precise connections, optimizing the functionality and performance of the product.

Nominal Supply Voltage-1: 1.8 V

Having a secondary nominal supply voltage of 1.8 V offers flexibility in power input options, catering to different system requirements and voltage levels.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type enables seamless communication and data transfer between different components and systems, enhancing connectivity and integration capabilities.

Technical Specifications

Other Function Interface ICs NLSX5011AMX1TCG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Additional Features:

CONFIGURABLE INTERFACE STANDARDS

Interface IC Type:

JESD-30 Code:

R-PBGA-B6

JESD-609 Code:

e4

Length:

1.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

2.8 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1 mm

Trade Compliance

NLSX5011AMX1TCG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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