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NLSX5004MNTWG

Onsemi

NLSX5004MNTWG by Onsemi

NLSX5004MNTWG by Onsemi is a 14-terminal interface IC with a max supply voltage of 4.5V and operating temperature range of -40 to 125 °C. It is designed for automotive applications, featuring a chip carrier package style and surface mount capability for compact installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,723 parts In-Stock

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Vyrian

USA . 1,570 parts In-Stock

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1,570

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Problanco Electronics

Mexico . 8,391 parts In-Stock

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Kulean Microsystems

USA . 8,327 parts In-Stock

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SupplyDigital Components

Austria . 7,967 parts In-Stock

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TANS Electronics

Latvia . 3,232 parts In-Stock

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Corphita

USA . 1,743 parts In-Stock

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Corohmni

South Africa . 265 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Overview

Unlock the power of seamless interface integration with the NLSX5004MNTWG by Onsemi. Designed with precision and excellence, this chip carrier with a very thin profile offers unparalleled performance in automotive applications. With a wide operating temperature range and high supply voltage capability, this interface circuit ensures reliability and efficiency. Say goodbye to compatibility issues and hello to smooth operation with the NLSX5004MNTWG. Elevate your projects with Onsemi's cutting-edge technology and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 4.5 V

Supports a wide range of supply voltages, making the IC versatile and compatible with different systems.

Package Shape: RECTANGULAR

Enables efficient placement on the PCB and optimal use of space within electronic devices.

No. of Terminals: 14

Provides multiple connection points for interfacing with other components or systems, enhancing functionality and flexibility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles offers thermal management benefits, compact form factor, and suitability for space-constrained applications.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage requirement enables energy-efficient operation and compatibility with different power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive applications and harsh operating environments.

Minimum Operating Temperature: -40 °C

Operational at low temperatures, ensuring reliable performance in various environmental conditions.

Terminal Position: QUAD

Quad terminal configuration allows for secure connections and efficient signal transmission within the IC.

Maximum Seated Height: 1 mm

Low profile design enables compact integration into electronic devices while maintaining adequate clearance.

Width: 2.5 mm

Narrow width facilitates placement on the PCB and conserves space in the overall system design.

Length: 3 mm

Compact length contributes to the small form factor of the IC, ideal for applications with limited space available.

Temperature Grade: AUTOMOTIVE

Designed and tested to meet automotive industry standards for temperature resistance and reliability in vehicle applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and enhances soldering performance during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and signal routing, suitable for high-density PCB layouts.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing between different systems or components, enabling seamless communication and functionality.

Technical Specifications

Other Function Interface ICs NLSX5004MNTWG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N14

Length:

3 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.5 mm

Trade Compliance

NLSX5004MNTWG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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