Loading...

NLSX5004MNTXG

Onsemi

NLSX5004MNTXG by Onsemi

NLSX5004MNTXG by Onsemi is a 14-terminal interface IC with a max supply voltage of 4.5V and min of 0.9V. It operates in temperatures ranging from -40 to 125 °C, making it suitable for automotive applications requiring a compact chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,495

-

-

-

-

Digiode

USA . 1,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,111

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,280

-

-

-

-

Problanco Electronics

Mexico . 7,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,743

-

-

-

-

SupplyDigital Components

Austria . 5,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,107

-

-

-

-

Kulean Microsystems

USA . 3,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,861

-

-

-

-

Corphita

USA . 1,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,840

-

-

-

-

Corohmni

South Africa . 452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

452

-

-

-

-

UHIMA Technologies

Türkiye . 130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

130

-

-

-

-

Overview

Enhance your electronic systems with the NLSX5004MNTXG by Onsemi, a top-quality interface IC designed to elevate performance and reliability. Crafted by the renowned manufacturer Onsemi, this chip carrier features a durable plastic/epoxy package body and a wide operating temperature range perfect for automotive applications. With 14 terminals and a slim profile design, this IC offers seamless integration and superior functionality. Upgrade your projects today with the NLSX5004MNTXG and experience the unmatched value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the IC, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 4.5 V

With a maximum supply voltage of 4.5V, this IC can handle a wide range of power inputs, making it versatile for different applications.

Package Shape: SQUARE

The square package shape provides a compact design, optimizing board space and facilitating efficient layout in electronic systems.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and interfaces, enabling the IC to perform various functions within a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers thermal management and space-saving benefits for enhanced performance.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage requirement of 0.9V makes this IC energy-efficient and suitable for battery-operated devices or low-power applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this IC can withstand high temperatures, making it ideal for automotive or industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliability and functionality in various environmental conditions, including extreme cold climates.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and connection of signals, contributing to improved signal integrity and reduced interference.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables a slim and compact design, making it suitable for space-constrained applications or devices.

Width: 3.5 mm

The narrow width of 3.5mm facilitates compact PCB layout and integration, saving space and enabling high-density circuit designs.

Length: 3.5 mm

The compact length of 3.5mm complements the square package shape, contributing to a space-efficient design for electronic systems.

Temperature Grade: AUTOMOTIVE

Being automotive grade ensures that the IC meets rigorous automotive industry standards for durability, reliability, and performance in automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form offers improved solder joint reliability, better thermal performance, and is environmentally friendly compared to traditional leaded components.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting and precise connections, enabling efficient signal transmission and reducing signal crosstalk.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC type, this product facilitates communication and data exchange between different parts of a system, enabling seamless operation and functionality.

Technical Specifications

Other Function Interface ICs NLSX5004MNTXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N14

Length:

3.5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

NLSX5004MNTXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19