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NLSX5004DR2G

Onsemi

NLSX5004DR2G by Onsemi

NLSX5004DR2G by Onsemi is a small outline interface IC with 14 terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and supports supply voltages from 0.9V to 4.5V. Ideal for applications requiring surface mount technology, such as automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,245 parts In-Stock

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Digiode

USA . 333 parts In-Stock

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TANS Electronics

Latvia . 6,796 parts In-Stock

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Problanco Electronics

Mexico . 5,510 parts In-Stock

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Corphita

USA . 2,203 parts In-Stock

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SupplyDigital Components

Austria . 1,169 parts In-Stock

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Kulean Microsystems

USA . 1,029 parts In-Stock

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Corohmni

South Africa . 482 parts In-Stock

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UHIMA Technologies

Türkiye . 199 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the NLSX5004DR2G. As a leader in the semiconductor industry, Onsemi ensures top-notch performance and durability in all their products. The NLSX5004DR2G falls under the category of Other Function Interface ICs, making it versatile for various applications. With a compact design and automotive-grade temperature range, this interface circuit offers exceptional value and benefits to customers looking for a reliable solution for their electronic needs. Trust Onsemi for innovative technology that delivers on performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the internal components of the interface IC, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time during production.

Maximum Supply Voltage: 4.5 V

With a maximum supply voltage of 4.5V, this interface IC can handle a wide range of power input levels, providing flexibility in different applications.

Package Shape: RECTANGULAR

Rectangular package shape offers compatibility with standard PCB layouts, making integration into existing designs seamless.

No. of Terminals: 14

Having 14 terminals allows for multiple connections to other components or devices, enabling versatile and complex circuit designs.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage requirement makes this interface IC energy-efficient and suitable for applications where power conservation is a priority.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh or demanding environments where temperatures may fluctuate.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in extreme cold conditions without compromising functionality.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances signal integrity, reducing the risk of connectivity issues.

Maximum Seated Height: 1.75 mm

Low seated height enables a compact and space-saving design for the overall system, especially in applications with limited space constraints.

Width: 3.9 mm

Narrow width of the package allows for efficient use of space on the PCB, ideal for compact designs or densely populated circuit boards.

Length: 8.65 mm

Optimal length provides a balance between functionality and space efficiency, making it suitable for various PCB layouts and configurations.

Temperature Grade: AUTOMOTIVE

Automotive-grade certification ensures reliability and performance in automotive applications, meeting industry standards for quality and durability.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections to the PCB, minimizing the risk of signal loss or disconnection.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with common PCB designs and facilitates easy soldering during assembly.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, this IC is optimized for signal processing and communication between different components or systems.

Technical Specifications

Other Function Interface ICs NLSX5004DR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

NLSX5004DR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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