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NLSX5004DTR2G

Onsemi

NLSX5004DTR2G by Onsemi

NLSX5004DTR2G by Onsemi is a small outline, thin profile interface IC with 14 terminals. It operates in automotive-grade temperatures from -40 to 125 °C and has a supply voltage range of 0.9V to 4.5V. Ideal for applications requiring an interface circuit in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,346 parts In-Stock

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Vyrian

USA . 2,319 parts In-Stock

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2,319

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,682 parts In-Stock

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7,682

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TANS Electronics

Latvia . 4,099 parts In-Stock

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Problanco Electronics

Mexico . 3,563 parts In-Stock

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Corphita

USA . 2,445 parts In-Stock

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Kulean Microsystems

USA . 1,325 parts In-Stock

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Corohmni

South Africa . 392 parts In-Stock

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UHIMA Technologies

Türkiye . 280 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NLSX5004DTR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality interface ICs like no other. This product is designed to optimize functionality and provide seamless integration for a variety of applications. With a compact design and reliable performance, this product offers unmatched value and benefits to customers looking for superior interface solutions. Trust Onsemi to elevate your electronic projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, making it suitable for mass production.

Maximum Supply Voltage: 4.5 V

Can handle higher voltage levels, providing flexibility for different applications.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space on PCBs.

No. of Terminals: 14

Provides multiple connection points for interfacing with other components.

Minimum Supply Voltage: 0.9 V

Can operate at low voltage levels, making it energy-efficient.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive applications where temperatures can vary.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without any issues.

Terminal Position: DUAL

Provides redundancy and ensures a reliable connection.

Maximum Seated Height: 1.2 mm

Low profile design allows for space-saving and efficient PCB layout.

Width: 4.4 mm

Compact width makes it suitable for small electronic devices or applications with space constraints.

Length: 5 mm

Compact length allows for flexible placement on a PCB.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards and requirements, ensuring reliability in automotive applications.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and make soldering easier during assembly.

Terminal Pitch: 0.65 mm

Fine pitch allows for high-density mounting, ideal for applications where space is limited.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components or systems, making it a versatile choice for a wide range of applications.

Technical Specifications

Other Function Interface ICs NLSX5004DTR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

NLSX5004DTR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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