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NLSX4401DFT2G

Onsemi

NLSX4401DFT2G by Onsemi

NLSX4401DFT2G by Onsemi is a small outline, thin profile interface IC with 6 terminals. It operates b/w -55 to 125 °C and has a supply voltage range of 1.5V to 5.5V. Ideal for military-grade applications requiring a compact, surface-mount solution.

Median Price

$0.060

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,020 parts In-Stock

1+ parts

-

100+ parts

$0.060

1k+ parts

$0.050

10k+ parts

$0.044

2,020

-

$0.060

$0.050

$0.044

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 828 parts In-Stock

1+ parts

$0.047

100+ parts

-

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-

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828

$0.047

-

-

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Vyrian

USA . 1,909 parts In-Stock

1+ parts

-

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1,909

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 822 parts In-Stock

1+ parts

$0.044

100+ parts

-

1k+ parts

-

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822

$0.044

-

-

-

Corohmni

South Africa . 426 parts In-Stock

1+ parts

$0.049

100+ parts

-

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426

$0.049

-

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Vigor

Singapore . 287 parts In-Stock

1+ parts

$0.140

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-

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287

$0.140

-

-

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Microchip USA

USA . 4,792 parts In-Stock

1+ parts

$0.485

100+ parts

-

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4,792

$0.485

-

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AZTECH Wire

Italy . 461 parts In-Stock

1+ parts

$15.770

100+ parts

-

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461

$15.770

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 27,642 parts In-Stock

1+ parts

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27,642

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Problanco Electronics

Mexico . 6,595 parts In-Stock

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6,595

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

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6,000

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SupplyDigital Components

Austria . 5,768 parts In-Stock

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5,768

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Kulean Microsystems

USA . 3,013 parts In-Stock

1+ parts

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3,013

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TANS Electronics

Latvia . 1,167 parts In-Stock

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1,167

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UHIMA Technologies

Türkiye . 936 parts In-Stock

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936

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Overview

Enhance your electronic designs with the NLSX4401DFT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that meet the highest standards. The NLSX4401DFT2G falls under the category of Other Function Interface ICs and offers a wide range of applications. With its small outline, thin profile, and shrink pitch package style, this interface circuit provides an unmatched level of performance. Trust Onsemi to provide reliable solutions for your electronic needs, ensuring efficiency and reliability in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this IC is compatible with a wide range of power sources, offering flexibility in design.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB, maximizing component density and minimizing footprint.

No. of Terminals: 6

Six terminals provide ample connectivity options for interfacing with other components, making it versatile in its applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this IC can withstand extreme cold environments, ensuring reliable performance in harsh conditions.

Technical Specifications

Other Function Interface ICs NLSX4401DFT2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.5 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLSX4401DFT2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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