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NL17SGU04AMUTCG

Onsemi

NL17SGU04AMUTCG by Onsemi

NL17SGU04AMUTCG by Onsemi is a CMOS Logic Gate with 6 terminals. It operates at temperatures from -55 to 125 °C and has a propagation delay of 15.6 ns at Vsup of 3V. Suitable for military applications due to its small size, low power consumption, and high operating temperature range.

Median Price

$0.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 93,000 parts In-Stock

1+ parts

-

100+ parts

$0.145

1k+ parts

$0.121

10k+ parts

$0.107

93,000

-

$0.145

$0.121

$0.107

Verical

USA . 90,000 parts In-Stock

1+ parts

-

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-

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10k+ parts

$0.134

90,000

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-

-

$0.134

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,833 parts In-Stock

1+ parts

$0.113

100+ parts

-

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1,833

$0.113

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Vyrian

USA . 5,478 parts In-Stock

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5,478

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 210 parts In-Stock

1+ parts

$0.107

100+ parts

-

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210

$0.107

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Corohmni

South Africa . 361 parts In-Stock

1+ parts

$0.119

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-

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361

$0.119

-

-

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AZTECH Wire

Italy . 188 parts In-Stock

1+ parts

$16.590

100+ parts

-

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188

$16.590

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$22.588

100+ parts

$20.555

1k+ parts

$18.522

10k+ parts

-

600

$22.588

$20.555

$18.522

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

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100+ parts

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25,000

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TANS Electronics

Latvia . 5,277 parts In-Stock

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5,277

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SupplyDigital Components

Austria . 3,513 parts In-Stock

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3,513

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Problanco Electronics

Mexico . 3,494 parts In-Stock

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3,494

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Kulean Microsystems

USA . 3,327 parts In-Stock

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3,327

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Microchip USA

USA . 199 parts In-Stock

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199

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UHIMA Technologies

Türkiye . 132 parts In-Stock

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132

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Overview

Experience next-level performance with the NL17SGU04AMUTCG by Onsemi. Crafted with precision and quality in mind, this logic gate offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this product is designed to meet your needs with its advanced features and cutting-edge technology. Trust Onsemi to deliver top-notch products that provide value, benefits, and advantages to customers across various industries. Elevate your projects with the NL17SGU04AMUTCG and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Propagation Delay At Nominal Supply: 13.8 ns

Low propagation delay ensures fast response times for signal processing.

Surface Mount: YES

Easy to mount on circuit boards, saves space and simplifies assembly process.

Nominal Supply Voltage / Vsup (V): 3

Compatible with standard supply voltage, easy to integrate into existing circuits.

Load Capacitance (CL): 30 pF

Suitable for driving moderate capacitive loads.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Compact design, suitable for applications with space constraints.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for industrial use.

Technology: CMOS

Low power consumption, suitable for battery-operated devices.

Technical Specifications

Logic Gates NL17SGU04AMUTCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

17SGU

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

.3 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

13.8 ns

Propagation Delay (tpd):

15.6 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NL17SGU04AMUTCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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