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NCV8402AT2G

Onsemi

NCV8402AT2G by Onsemi

NCV8402AT2G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 42V DS Breakdown Voltage, 150mJ Avalanche Energy Rating, and 2A Drain Current. This MOSFET operates in ENHANCEMENT MODE with a 0.2 ohm RDS(on), making it ideal for automotive (AEC-Q101) and industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,075 parts In-Stock

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Vyrian

USA . 1,097 parts In-Stock

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1,097

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Problanco Electronics

Mexico . 4,285 parts In-Stock

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4,285

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SupplyDigital Components

Austria . 2,346 parts In-Stock

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TANS Electronics

Latvia . 2,060 parts In-Stock

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Kulean Microsystems

USA . 829 parts In-Stock

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829

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Corohmni

South Africa . 366 parts In-Stock

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366

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Corphita

USA . 294 parts In-Stock

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UHIMA Technologies

Türkiye . 59 parts In-Stock

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Overview

Unleash the power of innovation with the NCV8402AT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that guarantee superior performance in switching applications. This N-CHANNEL transistor with a built-in diode offers unrivaled value and benefits, ensuring efficiency and reliability in every use. Say goodbye to compromises and experience the next level of electronic engineering with the NCV8402AT2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for a wide range of operating conditions.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and switching capabilities, enhancing the overall performance of the product.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design and offers added functionality with the built-in diode, making it versatile for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and reliable performance in controlling power flow.

Surface Mount: YES

Enables easy and convenient installation on circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 42 V

Offers a high breakdown voltage, providing protection against voltage spikes and ensuring the durability of the product.

Maximum Drain Current (Abs) (ID): 2 A

Capable of handling high currents, allowing for efficient power management in various applications.

Maximum Power Dissipation (Abs): 1.7 W

Withstands high power dissipation, ensuring the reliability and longevity of the product under heavy loads.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, suitable for industrial and automotive applications where heat dissipation is crucial.

Technical Specifications

Power Field Effect Transistors (FET) NCV8402AT2G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

42 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NCV8402AT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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