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NCV8440STT3G

Onsemi

NCV8440STT3G by Onsemi

NCV8440STT3G by Onsemi is a single N-channel FET with built-in diode for switching applications. It features a min DS breakdown voltage of 52V, max pulsed drain current of 10A, and max operating temperature of 150 °C. This MOSFET has a package style of small outline and terminal finish in matte tin, suitable for power management systems.

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Vyrian

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AZTECH Wire

Italy . 171 parts In-Stock

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Kepictronics

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Kulean Microsystems

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Problanco Electronics

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Corphita

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SupplyDigital Components

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UHIMA Technologies

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Overview

Unlock the power of innovation with the NCV8440STT3G by Onsemi. This high-quality Power FET boasts a single configuration with a built-in diode, perfect for switching applications. With a maximum pulsing drain current of 10A and an avalanche energy rating of 110mJ, this transistor offers unparalleled performance. Its small outline package and matte tin terminal finish make installation a breeze, while its N-channel design ensures efficient operation. Trust Onsemi for reliable, cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics and lower on-state resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps with protection against reverse polarity and simplifies circuit design.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring efficient performance.

Surface Mount: YES

Suitable for automated assembly processes and compact design requirements.

Minimum DS Breakdown Voltage: 52 V

The high breakdown voltage offers robustness and reliability in high-voltage applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement on circuit boards and efficient use of space.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have lower conduction losses and are easier to control in switching applications.

Maximum Pulsed Drain Current (IDM): 10 A

High pulsed drain current capability allows for handling surge currents and peak power requirements.

Avalanche Energy Rating (EAS): 110 mJ

High avalanche energy rating ensures protection against voltage spikes and transient events.

No. of Terminals: 3

Simple 3-terminal configuration for ease of connection and integration into circuit designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for efficient board layout.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in various applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures stability and performance in harsh environments.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties and stability for consistent performance.

Terminal Finish: MATTE TIN

Matte tin finish offers reliable solder connections and resistance to corrosion.

Maximum Drain Current (ID): 2.6 A

Sufficient drain current capacity for medium-power applications and efficient operation.

Maximum Drain-Source On Resistance: 0.95 ohm

Low drain-source on resistance results in reduced power losses and improved efficiency.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit design and versatile connections.

Case Connection: DRAIN

Drain connection provides easy heat dissipation and efficient current flow management.

Technical Specifications

Power Field Effect Transistors (FET) NCV8440STT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.95 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NCV8440STT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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