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NCV8406ADTRKG

Onsemi

NCV8406ADTRKG by Onsemi

NCV8406ADTRKG by Onsemi is an N-CHANNEL FET for SWITCHING applications. It has a 60V DS Breakdown Voltage, 0.24 ohm Drain-Source On Resistance, and 2.31W Power Dissipation. This MOSFET operates in ENHANCEMENT MODE with a temperature range of -40 to 150 °C.

Median Price

$1.103

Lifecycle Status

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11

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 3,234 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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$0.781

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$0.781

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Bristol Electronics

USA . 15 parts In-Stock

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$1.425

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Chip Stock

USA . 9,491 parts In-Stock

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Vyrian

USA . 8,345 parts In-Stock

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USA . 3,234 parts In-Stock

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Sensible Micro Corp

USA . 2,398 parts In-Stock

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Digiode

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Cyclops Electronics Ltd

UK . 60 parts In-Stock

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Electronic Treasures

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NexGen Digital

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Vigor

Singapore . 950 parts In-Stock

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$0.500

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Argo Parts USA

USA . 2,698 parts In-Stock

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$0.781

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Continental Prestige Electronics

USA . 1,127 parts In-Stock

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$0.781

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$0.765

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Netroflash

USA . 100 parts In-Stock

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$0.781

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$0.765

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$0.781

$0.765

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$0.785

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$0.746

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$0.746

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60

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Aztec Data Supply Inc.

USA . 223 parts In-Stock

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$2.710

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Microchip USA

USA . 4,555 parts In-Stock

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Semicontronic

India . 3,135 parts In-Stock

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$6.050

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$5.899

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$5.868

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AZTECH Wire

Italy . 996 parts In-Stock

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$21.960

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Ampacity Inc.

Singapore . 3,173 parts In-Stock

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$39.050

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RC Electronics

USA . 51,268 parts In-Stock

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Lixinc

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 397 parts In-Stock

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Corohmni

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Corphita

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Overview

The NCV8406ADTRKG by Onsemi is a top-of-the-line Power Field Effect Transistor that promises unparalleled quality and performance. With its N-CHANNEL polarity and COMPLEX configuration, this transistor is ideal for SWITCHING applications. What sets this product apart is its reliability and efficiency, allowing for seamless operation in a variety of electronic devices. Whether you're looking to enhance the functionality of your equipment or improve power management, the NCV8406ADTRKG delivers on all fronts. Trust Onsemi's expertise in semiconductor technology and invest in a product that offers exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the inner components, making this FET suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer better performance and efficiency compared to P-channel FETs, making this a reliable choice for switching applications.

Configuration: COMPLEX

The complex configuration allows for versatile use in different circuit designs, making this FET a versatile option for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient and reliable performance in controlling power flow.

Surface Mount: YES

With surface mount capability, this FET can be easily integrated onto circuit boards, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes, making this FET suitable for high voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and placement within circuits, optimizing space and facilitating efficient circuit design.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering, ensuring reliable performance in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for precise control and efficient performance, making this FET ideal for applications requiring high switching speeds.

Avalanche Energy Rating (EAS): 110 mJ

With a high avalanche energy rating, this FET can withstand sudden voltage surges, ensuring long-term reliability in rugged conditions.

No. of Terminals: 2

Two terminals provide simple and easy connectivity, making it straightforward to integrate this FET into existing circuit designs.

Maximum Power Dissipation (Abs): 2.31 W

The high power dissipation rating allows for reliable operation under heavy loads, ensuring consistent performance in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and facilitates compact circuit designs, making this FET suitable for applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology ensures high efficiency and performance, making this FET a reliable choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, ensuring reliable performance in harsh environments.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides high conductivity and durability, ensuring long-term reliability in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in cold environments, making this FET suitable for a wide range of operating conditions.

Maximum Drain-Source On Resistance: 0.24 ohm

The low drain-source on resistance minimizes power loss and improves efficiency, making this FET suitable for high-performance applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, ensuring ease of integration into circuit designs.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and improved thermal performance, ensuring reliable operation under varying load conditions.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 automotive standard, this FET meets stringent quality and reliability requirements, making it a suitable choice for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NCV8406ADTRKG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.24 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NCV8406ADTRKG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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