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NCV8415STT1G

Onsemi

NCV8415STT1G by Onsemi

NCV8415STT1G by Onsemi is an N-CHANNEL FET with 42V DS Breakdown Voltage, ideal for SWITCHING applications. It features a built-in DIODE, 88mJ Avalanche Energy Rating, and 0.12 ohm Drain-Source On Resistance. This ENHANCEMENT MODE transistor operates b/w -40 to 150 °C and meets AEC-Q101 standards.

Median Price

$0.910

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,782 parts In-Stock

1+ parts

$0.910

100+ parts

$0.577

1k+ parts

$0.472

10k+ parts

$0.429

2,782

$0.910

$0.577

$0.472

$0.429

DigiKey

USA . 1,957 parts In-Stock

1+ parts

$0.910

100+ parts

$0.514

1k+ parts

$0.444

10k+ parts

$0.407

1,957

$0.910

$0.514

$0.444

$0.407

Flip Electronics (Authorized)

USA . 71,000 parts In-Stock

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Verical

USA . 24,000 parts In-Stock

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$0.377

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$0.377

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Distributors (In-Stock)

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Digiode

USA . 1,897 parts In-Stock

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$0.940

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Vyrian

USA . 1,798 parts In-Stock

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$0.990

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Flip Electronics

USA . 55,000 parts In-Stock

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Chip Stock

USA . 6,500 parts In-Stock

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Corphita

USA . 1,161 parts In-Stock

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$0.891

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Corohmni

South Africa . 224 parts In-Stock

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$0.990

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Microchip USA

USA . 2,599 parts In-Stock

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$3.100

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SupplyDigital Components

Austria . 8,050 parts In-Stock

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TANS Electronics

Latvia . 7,534 parts In-Stock

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Kulean Microsystems

USA . 2,482 parts In-Stock

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Problanco Electronics

Mexico . 1,153 parts In-Stock

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Vigor

Singapore . 191 parts In-Stock

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UHIMA Technologies

Türkiye . 99 parts In-Stock

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Overview

Discover the NCV8415STT1G by Onsemi, a high-quality Power Field Effect Transistor that offers unmatched performance and reliability. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-CHANNEL FET is perfect for switching applications, providing a seamless experience for customers seeking efficiency and precision. Benefit from its built-in diode, small outline package style, and enhanced mode of operation. Trust in Onsemi to deliver a product that exceeds expectations and unlocks new possibilities in your projects. Choose the NCV8415STT1G for superior quality and performance that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the transistor, making it durable and reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and faster switching speeds, making them suitable for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for convenient reverse voltage protection, reducing the need for external components and simplifying circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in controlling current flow.

Maximum Power Dissipation (Abs): 2.2 W

With a high power dissipation rating, this FET can handle moderate power levels effectively without overheating or failing under normal operating conditions.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures without compromising performance, suitable for applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) NCV8415STT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

88 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

42 V

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

90000 ns

Maximum Turn On Time (ton):

20000 ns

Trade Compliance

NCV8415STT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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