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NCV8415STT3G

Onsemi

NCV8415STT3G by Onsemi

NCV8415STT3G by Onsemi is an N-CHANNEL FET with 42V DS Breakdown Voltage, ideal for SWITCHING applications. It features a built-in DIODE, 88mJ EAS rating, and 0.12 ohm RDS(ON). Operating from -40 to 150 °C, it is AEC-Q101 compliant and suitable for automotive systems.

Median Price

$0.910

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 8,000 parts In-Stock

1+ parts

$0.910

100+ parts

$0.514

1k+ parts

$0.444

10k+ parts

$0.409

8,000

$0.910

$0.514

$0.444

$0.409

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$0.910

100+ parts

$0.481

1k+ parts

$0.444

10k+ parts

$0.429

250

$0.910

$0.481

$0.444

$0.429

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,998 parts In-Stock

1+ parts

$0.950

100+ parts

-

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1,998

$0.950

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Vyrian

USA . 2,174 parts In-Stock

1+ parts

$1.000

100+ parts

-

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-

2,174

$1.000

-

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NAC Semi

USA . 8,000 parts In-Stock

1+ parts

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10k+ parts

$0.700

8,000

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-

$0.700

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,530 parts In-Stock

1+ parts

$0.900

100+ parts

-

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1,530

$0.900

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Corohmni

South Africa . 257 parts In-Stock

1+ parts

$1.000

100+ parts

-

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257

$1.000

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Microchip USA

USA . 6,401 parts In-Stock

1+ parts

$2.894

100+ parts

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6,401

$2.894

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Component Stockers USA

USA . 4,523 parts In-Stock

1+ parts

$6.250

100+ parts

-

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10k+ parts

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4,523

$6.250

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SupplyDigital Components

Austria . 7,981 parts In-Stock

1+ parts

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7,981

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TANS Electronics

Latvia . 3,804 parts In-Stock

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3,804

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Kulean Microsystems

USA . 2,578 parts In-Stock

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2,578

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Problanco Electronics

Mexico . 2,076 parts In-Stock

1+ parts

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2,076

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UHIMA Technologies

Türkiye . 171 parts In-Stock

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171

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Overview

Unlock the power of the NCV8415STT3G by Onsemi and experience top-notch quality in Power Field Effect Transistors (FET). With a single configuration and built-in diode, this N-channel transistor is perfect for switching applications. Enjoy the benefits of enhanced mode operation, high breakdown voltage, and low on-resistance, all in a compact package. Trust Onsemi's reputation for excellence and reliability to deliver exceptional performance in your designs. Elevate your projects with the NCV8415STT3G and experience seamless functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and reliability are important.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and allows for more compact layouts, saving space and improving overall efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast turn-on and turn-off times, making it efficient in power management.

Surface Mount: YES

Being surface mountable makes installation easier and allows for automated assembly processes, which can reduce production costs.

Minimum DS Breakdown Voltage: 42 V

With a high minimum breakdown voltage, this FET can handle higher voltages, providing a reliable and robust solution for various applications.

Maximum Power Dissipation (Abs): 2.2 W

The high maximum power dissipation rating ensures that the FET can handle power surges and operate in demanding conditions without overheating.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology ensures high performance, low power consumption, and reliable operation, making it a great choice for energy-efficient applications.

Maximum Drain-Source On Resistance: 0.12 ohm

The low drain-source on resistance minimizes power loss and voltage drop when the FET is conducting, improving overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) NCV8415STT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

88 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

42 V

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

90000 ns

Maximum Turn On Time (ton):

20000 ns

Trade Compliance

NCV8415STT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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