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NCV8440STT1G

Onsemi

NCV8440STT1G by Onsemi

NCV8440STT1G by Onsemi is a Power FET with 52V DS Breakdown Voltage, 10A IDM, and 0.95 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications in ENHANCEMENT MODE. The package is RECTANGULAR with GULL WING terminals, suitable for surface mount installation.

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1k+

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Vyrian

USA . 7,779 parts In-Stock

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Digiode

USA . 1,106 parts In-Stock

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AZTECH Wire

Italy . 164 parts In-Stock

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$8.180

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Problanco Electronics

Mexico . 6,925 parts In-Stock

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SupplyDigital Components

Austria . 5,324 parts In-Stock

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UHIMA Technologies

Türkiye . 910 parts In-Stock

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Kulean Microsystems

USA . 494 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 311 parts In-Stock

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Unlock the power of high-quality performance with the NCV8440STT1G by Onsemi. This Power Field Effect Transistor (FET) offers unparalleled reliability and efficiency, making it a top choice for various switching applications. With its single configuration and built-in diode, this transistor delivers superior functionality that exceeds expectations. Experience seamless operation and enhanced productivity with the NCV8440STT1G, designed to meet the demands of modern technology. Elevate your projects with this innovative solution from a renowned manufacturer, providing unmatched value and benefits for your every need.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher mobility, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for the suppression of back EMF and provides added protection for the circuit, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-state resistance, ideal for power management and control.

Surface Mount: YES

Being surface mountable makes the FET easy to integrate onto PCBs, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 52 V

With a minimum breakdown voltage of 52V, this FET can handle higher voltages without risking damage, ensuring a reliable performance under varying conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and layout on a PCB, optimizing space utilization and facilitating efficient circuit design.

Terminal Form: GULL WING

The gull wing terminal form provides stability and ease of soldering during the assembly process, ensuring a secure and reliable connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer simple control of the ON/OFF state, providing efficient power management and enabling easy integration into various circuits.

Maximum Pulsed Drain Current (IDM): 10 A

The high maximum pulsed drain current of 10A allows the FET to handle sudden spikes in current, making it suitable for applications requiring robust performance.

Avalanche Energy Rating (EAS): 110 mJ

The high avalanche energy rating of 110mJ indicates the FET's capability to withstand voltage spikes and transient events, ensuring long-term reliability in demanding conditions.

No. of Terminals: 3

With 3 terminals, the FET offers simplified connections and easy integration into circuits, reducing complexity and enhancing overall performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for high-density mounting of components, making it ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in the FET offers high switching speeds, low power consumption, and improved performance, suitable for efficient power management.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand elevated temperatures, ensuring reliable operation in harsh environments.

Transistor Element Material: SILICON

Silicon as the transistor element material offers high thermal conductivity and efficiency, enabling the FET to handle power dissipation effectively and operate reliably.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures a secure electrical connection, improving the overall durability and longevity of the FET.

Maximum Drain Current (ID): 2.6 A

The maximum drain current of 2.6A indicates the FET's capability to handle continuous current flow, making it suitable for various power management applications.

Maximum Drain-Source On Resistance: 0.95 ohm

With a low drain-source ON resistance of 0.95 ohms, this FET minimizes power losses and heat dissipation, improving efficiency and overall performance.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, allowing for easy connections and enhancing compatibility with different configurations.

Case Connection: DRAIN

The DRAIN case connection allows for easy thermal management and efficient heat dissipation, ensuring optimal performance and reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) NCV8440STT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.95 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NCV8440STT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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