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NCV8415DTRKG

Onsemi

NCV8415DTRKG by Onsemi

NCV8415DTRKG by Onsemi is an N-CHANNEL FET with 42V DS Breakdown Voltage, ideal for SWITCHING applications. It features a built-in DIODE, 2.99W Power Dissipation, and operates in ENHANCEMENT MODE. With a max temperature of 150 °C, it is suitable for AEC-Q101 standards in automotive electronics.

Median Price

$0.859

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 14,719 parts In-Stock

1+ parts

$1.090

100+ parts

$0.627

1k+ parts

$0.543

10k+ parts

$0.503

14,719

$1.090

$0.627

$0.543

$0.503

Mouser Electronics

USA . 3,507 parts In-Stock

1+ parts

$1.090

100+ parts

$0.587

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$0.544

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$0.529

3,507

$1.090

$0.587

$0.544

$0.529

Future Electronics

Canada . 2,500 parts In-Stock

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$0.450

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$0.450

Verical

USA . 2,500 parts In-Stock

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$0.628

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$0.628

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Vyrian

USA . 1,086 parts In-Stock

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$0.463

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NAC Semi

USA . 5,000 parts In-Stock

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$0.864

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Flip Electronics

USA . 5,000 parts In-Stock

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IBS Electronics

USA . 2,500 parts In-Stock

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$0.603

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$0.603

Digiode

USA . 222 parts In-Stock

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Corohmni

South Africa . 73 parts In-Stock

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$0.442

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Microchip USA

USA . 2,776 parts In-Stock

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$8.385

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TANS Electronics

Latvia . 7,222 parts In-Stock

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SupplyDigital Components

Austria . 4,771 parts In-Stock

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Problanco Electronics

Mexico . 4,069 parts In-Stock

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Kulean Microsystems

USA . 1,364 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 378 parts In-Stock

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Overview

Enhance your power management solutions with the NCV8415DTRKG by Onsemi. This high-quality Power FET boasts a single configuration with a built-in diode, perfect for switching applications. With a minimum DS breakdown voltage of 42V and an avalanche energy rating of 470 mJ, this transistor offers superior performance. Its small outline package shape and Gull Wing terminal form make it easy to integrate into various designs. Trust Onsemi's expertise in semiconductor technology and choose the NCV8415DTRKG for reliable, efficient power control in automotive, industrial, and consumer electronics applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides good durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel type offers lower conduction losses and faster switching speeds compared to P-Channel, making it efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier control of current flow and protection against reverse voltage, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in various electronic circuits.

Minimum DS Breakdown Voltage: 42 V

High breakdown voltage ensures the transistor can handle higher voltage applications without damage, increasing its versatility.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching process, allowing for precise operation and improved efficiency.

Maximum Power Dissipation (Abs): 2.99 W

High power dissipation rating indicates the transistor can handle higher power levels without overheating, ensuring reliable performance under load.

Maximum Operating Temperature: 150 °C

High operating temperature range allows for the transistor to be used in various environments without compromising its performance.

Technical Specifications

Power Field Effect Transistors (FET) NCV8415DTRKG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

470 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

42 V

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

90000 ns

Maximum Turn On Time (ton):

20000 ns

Trade Compliance

NCV8415DTRKG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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