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NCV8440ASTT1G

Onsemi

NCV8440ASTT1G by Onsemi

NCV8440ASTT1G by Onsemi is a single N-channel FET with built-in diode for switching applications. It features a min DS breakdown voltage of 52V, max pulsed drain current of 10A, and max power dissipation of 1.69W. This MOSFET operates in enhancement mode with a max operating temperature of 150 °C, making it suitable for various power management tasks.

Median Price

$1.110

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,153 parts In-Stock

1+ parts

$1.110

100+ parts

$0.613

1k+ parts

$0.482

10k+ parts

-

2,153

$1.110

$0.613

$0.482

-

Newark

USA . 312 parts In-Stock

1+ parts

$1.190

100+ parts

$0.675

1k+ parts

$0.496

10k+ parts

-

312

$1.190

$0.675

$0.496

-

Farnell

UK . 338 parts In-Stock

1+ parts

$1.310

100+ parts

$0.740

1k+ parts

$0.485

10k+ parts

-

338

$1.310

$0.740

$0.485

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DigiKey

USA . 397 parts In-Stock

1+ parts

$1.700

100+ parts

$0.724

1k+ parts

$0.522

10k+ parts

$0.421

397

$1.700

$0.724

$0.522

$0.421

Element14

Singapore . 338 parts In-Stock

1+ parts

$2.240

100+ parts

$1.060

1k+ parts

$0.828

10k+ parts

-

338

$2.240

$1.060

$0.828

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Flip Electronics (Authorized)

USA . 7,000 parts In-Stock

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7,000

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Chip1Stop

Japan . 2,000 parts In-Stock

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-

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$0.472

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2,000

-

-

$0.472

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.580

10k+ parts

$0.510

1,000

-

-

$0.580

$0.510

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.488

10k+ parts

$0.418

1,000

-

-

$0.488

$0.418

Rochester

USA . 127 parts In-Stock

1+ parts

-

100+ parts

$0.572

1k+ parts

$0.475

10k+ parts

$0.423

127

-

$0.572

$0.475

$0.423

Distributors (In-Stock)

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Digiode

USA . 114 parts In-Stock

1+ parts

$0.445

100+ parts

-

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-

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114

$0.445

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-

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Vyrian

USA . 716 parts In-Stock

1+ parts

$0.468

100+ parts

-

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716

$0.468

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Flip Electronics

USA . 7,000 parts In-Stock

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7,000

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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NAC Semi

USA . 4,000 parts In-Stock

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$0.956

10k+ parts

$0.860

4,000

-

-

$0.956

$0.860

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,575 parts In-Stock

1+ parts

$0.421

100+ parts

-

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1,575

$0.421

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Corohmni

South Africa . 209 parts In-Stock

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$0.468

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209

$0.468

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Continental Prestige Electronics

USA . 78 parts In-Stock

1+ parts

$0.810

100+ parts

$0.561

1k+ parts

$0.347

10k+ parts

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78

$0.810

$0.561

$0.347

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Microchip USA

USA . 5,696 parts In-Stock

1+ parts

$3.481

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5,696

$3.481

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Perfect Parts

USA . 234,584 parts In-Stock

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234,584

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Kepictronics

USA . 15,785 parts In-Stock

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TANS Electronics

Latvia . 8,245 parts In-Stock

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Problanco Electronics

Mexico . 5,045 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,999 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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Kulean Microsystems

USA . 1,065 parts In-Stock

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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73

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Overview

Enhance your power management solutions with the NCV8440ASTT1G by Onsemi. Designed with quality and precision, this N-CHANNEL Power FET offers reliability and efficiency for a wide range of switching applications. With a maximum pulsed drain current of 10A and a minimum DS breakdown voltage of 52V, this transistor provides exceptional performance while maintaining a compact and durable design. Whether you're looking to optimize your power distribution or improve system control, the NCV8440ASTT1G delivers value, benefits, and advantages that will exceed your expectations. Upgrade your power management capabilities today with Onsemi's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the Power FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher current-carrying capabilities, making them ideal for high-performance applications.

Minimum DS Breakdown Voltage: 52 V

The high breakdown voltage allows for safe operation in high voltage applications, providing overvoltage protection.

Maximum Pulsed Drain Current (IDM): 10 A

The high pulsed drain current rating enables the FET to handle large current spikes without damage, making it suitable for switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) NCV8440ASTT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (Abs) (ID):

2.6 A

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NCV8440ASTT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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