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NBSG53ABA

Onsemi

NBSG53ABA by Onsemi

NBSG53ABA by Onsemi is a clock driver with 0.275 ns propagation delay, suitable for differential input conditioning. Operating b/w -40 to 70 °C, it has a 16-terminal grid array package with low profile design. Ideal for applications requiring precise timing and signal synchronization in electronic systems.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Vyrian

USA . 4,489 parts In-Stock

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Digiode

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Elcom Components

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Connector Distribution Corp

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Right Parts Inc.

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AZTECH Wire

Italy . 337 parts In-Stock

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$10.790

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SupplyDigital Components

Austria . 7,284 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 5,866 parts In-Stock

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Problanco Electronics

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Corphita

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Corohmni

South Africa . 333 parts In-Stock

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UHIMA Technologies

Türkiye . 310 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic projects with the NBSG53ABA clock driver by Onsemi, a top-tier manufacturer known for quality and reliability. Clock drivers & buffers play a crucial role in ensuring smooth data transmission, and this product excels in providing low propagation delay and differential input conditioning. With a wide range of power supplies and compact package style, the NBSG53ABA offers unparalleled value and performance. Elevate your designs with this versatile solution that guarantees precision and efficiency in any application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 0.275 ns

Low propagation delay ensures fast signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage of 2.5V ensures consistent performance and compatibility with standard power sources.

Power Supplies (V): -2.5/-3.3/2.5/3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility spectrums.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components in a circuit.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array and low-profile package style ensure easy installation and space-saving in compact electronic devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature rating enables reliable performance even in elevated thermal conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range from -40 to 70 °C allows for operation in diverse environmental conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides strong solder connections for secure attachment to circuit boards.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easy PCB mounting and connectivity with other components.

Maximum Seated Height: 1.4 mm

Low seated height of 1.4mm enables slim profile designs and efficient use of vertical space in electronic assemblies.

Width: 4 mm

Compact width of 4mm allows for tight integration in crowded PCB layouts.

Minimum Supply Voltage (Vsup): 2.375 V

Support for low minimum supply voltage of 2.375V ensures operation in power-constrained scenarios.

Length: 4 mm

Short length of 4mm helps in space-constrained layouts and compact device designs.

Terminal Form: BALL

Ball terminal form provides secure electrical connections and ease of soldering during assembly.

Terminal Pitch: 1 mm

Fine terminal pitch of 1mm allows for dense packing and high interconnect density on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during manufacturing and storage.

Maximum Supply Voltage (Vsup): 3.465 V

High maximum supply voltage ensures compatibility with varied power sources and robust performance under different operating conditions.

Technical Specifications

Clock Drivers & Buffers NBSG53ABA attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

53

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e0

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Power Supplies (V):

-2.5/-3.3/2.5/3.3

Propagation Delay At Nominal Supply:

.275 ns

Propagation Delay (tpd):

.275 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

4 mm

Trade Compliance

NBSG53ABA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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