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NB3N853501EDTG

Onsemi

NB3N853501EDTG by Onsemi

NB3N853501EDTG clock driver by Onsemi has a 2ns propagation delay at 3.3V, suitable for industrial applications. It features differential mux input conditioning and offers 4 true outputs with a max supply voltage of 3.465V, making it ideal for high-speed signal processing in compact designs.

Median Price

$3.842

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 15 parts In-Stock

1+ parts

$3.760

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$3.760

-

-

-

Arrow

USA . 15 parts In-Stock

1+ parts

$4.028

100+ parts

$3.470

1k+ parts

$3.327

10k+ parts

-

15

$4.028

$3.470

$3.327

-

DigiKey

USA . 41 parts In-Stock

1+ parts

$11.540

100+ parts

$9.938

1k+ parts

-

10k+ parts

-

41

$11.540

$9.938

-

-

Farnell

UK . 45,225 parts In-Stock

1+ parts

-

100+ parts

$2.580

1k+ parts

-

10k+ parts

-

45,225

-

$2.580

-

-

Rochester

USA . 42,271 parts In-Stock

1+ parts

-

100+ parts

$3.140

1k+ parts

$2.810

10k+ parts

$2.650

42,271

-

$3.140

$2.810

$2.650

Verical

USA . 42,065 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.513

10k+ parts

$3.313

42,065

-

$3.925

$3.513

$3.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,291 parts In-Stock

1+ parts

$2.669

100+ parts

-

1k+ parts

-

10k+ parts

-

1,291

$2.669

-

-

-

Vyrian

USA . 2,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,850

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,526 parts In-Stock

1+ parts

$2.190

100+ parts

-

1k+ parts

-

10k+ parts

-

14,526

$2.190

-

-

-

Corphita

USA . 1,792 parts In-Stock

1+ parts

$2.528

100+ parts

-

1k+ parts

-

10k+ parts

-

1,792

$2.528

-

-

-

Corohmni

South Africa . 478 parts In-Stock

1+ parts

$2.580

100+ parts

-

1k+ parts

-

10k+ parts

-

478

$2.580

-

-

-

Microchip USA

USA . 286 parts In-Stock

1+ parts

$32.956

100+ parts

-

1k+ parts

-

10k+ parts

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286

$32.956

-

-

-

Continental Prestige Electronics

USA . 42,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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42,271

-

-

-

-

Kulean Microsystems

USA . 7,521 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,521

-

-

-

-

Perfect Parts

USA . 2,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,680

-

-

-

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Problanco Electronics

Mexico . 1,804 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,804

-

-

-

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SupplyDigital Components

Austria . 1,521 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,521

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

GreenTree Electronics

Israel . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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750

-

-

-

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UHIMA Technologies

Türkiye . 206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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206

-

-

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TANS Electronics

Latvia . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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40

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-

-

Overview

Elevate your clock driver needs with the NB3N853501EDTG from Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. Clock drivers & buffers play a crucial role in maintaining precision timing in various electronic devices. With a low propagation delay of just 2 ns, this product guarantees fast and efficient performance. Its compact design, high temperature tolerance, and differential input conditioning make it ideal for industrial applications. Trust Onsemi to deliver exceptional value and superior functionality with the NB3N853501EDTG. Experience seamless operation and enhanced performance with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability for the product.

Propagation Delay At Nominal Supply: 2 ns

The low propagation delay of 2 ns ensures high-speed performance of the product.

Surface Mount: YES

The surface mount capability makes it easy to integrate the product onto PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with a wide range of electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the product to operate reliably in various environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures the product can function even in harsh conditions.

Width: 4.4 mm

The compact width of 4.4 mm allows for space-efficient placement on PCBs.

No. of True Outputs: 4

The 4 true outputs provide flexibility and options for connecting to other components in the system.

Technical Specifications

Clock Drivers & Buffers NB3N853501EDTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

3N

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

2 ns

Propagation Delay (tpd):

2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.03 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NB3N853501EDTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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