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MTC-20285

Onsemi

MTC-20285 by Onsemi

The Onsemi MTC-20285 is a digital transmission interface IC with 144 terminals in a square flatpack package. It operates b/w 0 °C to 70°C, suitable for commercial telecom applications like ISDN controllers. With a compact size of 28x28mm and Gull Wing terminals, it offers high performance in surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,233 parts In-Stock

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Digiode

USA . 573 parts In-Stock

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573

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Distributors (Availability)

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Kulean Microsystems

USA . 7,182 parts In-Stock

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TANS Electronics

Latvia . 5,130 parts In-Stock

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Problanco Electronics

Mexico . 4,789 parts In-Stock

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SupplyDigital Components

Austria . 1,879 parts In-Stock

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Corphita

USA . 1,411 parts In-Stock

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Corohmni

South Africa . 404 parts In-Stock

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404

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UHIMA Technologies

Türkiye . 150 parts In-Stock

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Overview

Enhance your digital communication systems with the MTC-20285 by Onsemi, a cutting-edge ISDN controller designed for seamless transmission interfaces. Manufactured with precision and expertise by Onsemi, this product offers unmatched quality and reliability. Ideal for various applications in the telecom industry, this innovative device provides customers with unparalleled value, benefits, and advantages. Upgrade your communication infrastructure today with the MTC-20285 and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection for the internal components of the product, ensuring its longevity.

Surface Mount: YES

Surface mount technology makes for easy and quick installation, saving time and effort during the manufacturing process.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options, making this product versatile and suitable for a variety of applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand heat and function reliably even in challenging environments.

Width: 28 mm

Compact width makes this product suitable for applications where space is limited, allowing for more flexibility in installation.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature range ensures that this product is suitable for standard operating conditions in commercial applications.

Telecom IC Type: ISDN CONTROLLER

Having an ISDN controller integrated into the product enables efficient data transmission over digital networks, making it a reliable choice for telecom applications.

Technical Specifications

Digital Transmission Interfaces MTC-20285 attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G144

Length:

28 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.91 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

MTC-20285 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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