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MTC-20276-PCINTQ

Onsemi

MTC-20276-PCINTQ by Onsemi

The Onsemi MTC-20276-PCINTQ is a 44-terminal ISDN controller chip carrier with J bend terminals. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 3.3V, it's ideal for digital transmission interfaces in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,836 parts In-Stock

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1,836

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Digiode

USA . 1,531 parts In-Stock

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1,531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,696 parts In-Stock

1+ parts

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7,696

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SupplyDigital Components

Austria . 6,141 parts In-Stock

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6,141

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Kulean Microsystems

USA . 2,309 parts In-Stock

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2,309

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TANS Electronics

Latvia . 1,017 parts In-Stock

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1,017

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Corphita

USA . 605 parts In-Stock

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605

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UHIMA Technologies

Türkiye . 480 parts In-Stock

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480

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Corohmni

South Africa . 159 parts In-Stock

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159

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Overview

Unleash the power of seamless digital communication with the MTC-20276-PCINTQ by Onsemi. Crafted with precision and expertise, this innovative digital transmission interface offers unparalleled quality and reliability. Ideal for a wide range of applications, this product is designed to elevate your communication experience. Say goodbye to disruptions and hello to seamless connectivity with the MTC-20276-PCINTQ. Trust in Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the product, making it suitable for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic devices.

No. of Terminals: 44

Having a high number of terminals allows for more connectivity options and versatility in system design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extremely cold environments.

Nominal Supply Voltage: 3.3 V

The low nominal supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

Technical Specifications

Digital Transmission Interfaces MTC-20276-PCINTQ attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

MTC-20276-PCINTQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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