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MTC-20276PQ-I

Onsemi

MTC-20276PQ-I by Onsemi

MTC-20276PQ-I by Onsemi is a CMOS ISDN controller with 44 terminals in a square flatpack package. Operating temperature range from 0 to 70 °C, suitable for digital transmission interfaces. Features include 3.3V supply voltage, quad terminal position, and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,850 parts In-Stock

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1,850

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Vyrian

USA . 1,517 parts In-Stock

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1,517

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TANS Electronics

Latvia . 8,093 parts In-Stock

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8,093

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Kulean Microsystems

USA . 6,979 parts In-Stock

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6,979

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Problanco Electronics

Mexico . 6,360 parts In-Stock

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6,360

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SupplyDigital Components

Austria . 5,880 parts In-Stock

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5,880

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UHIMA Technologies

Türkiye . 802 parts In-Stock

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802

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Corphita

USA . 454 parts In-Stock

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454

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Discover the cutting-edge MTC-20276PQ-I by Onsemi, a top-tier manufacturer of digital transmission interfaces. This high-quality product offers unparalleled performance and reliability in a compact square package. Ideal for ISDN controller applications, this telecom IC boasts a nominal supply voltage of 3.3V and operates seamlessly in commercial temperature grades. Elevate your projects with the value and benefits that only Onsemi can provide, ensuring seamless connectivity and optimal functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring reliable performance over time.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto circuit boards, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape allows for a compact design, ideal for applications where space is limited.

No. of Terminals: 44

With a high number of terminals, this product can support complex connectivity requirements, making it versatile for a range of applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can withstand elevated temperatures without compromising performance, making it suitable for various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function reliably even in colder conditions, enhancing its usability in diverse settings.

Terminal Position: QUAD

The quad terminal position enables efficient connections and ensures a secure fit, contributing to the overall reliability of the product.

Width: 10 mm

The compact width of the product makes it suitable for applications with space constraints, providing flexibility in installation.

Length: 10 mm

The small length of the product further enhances its space-saving design, allowing for easy integration into various systems.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, leading to efficient operation and enhanced performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, making integration into existing systems seamless.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm facilitates close placement of components on a circuit board, enabling high-density layouts and efficient signal routing.

Technical Specifications

Digital Transmission Interfaces MTC-20276PQ-I attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MTC-20276PQ-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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