Loading...

MTC-20172-PC

Onsemi

MTC-20172-PC by Onsemi

The Onsemi MTC-20172-PC is a Digital Transmission Interface chip carrier with 28 terminals. Operating temperature range of 0 to 70 °C, suitable for ISDN controller applications. Features J bend terminals, surface mountable in commercial-grade telecom devices at 5V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

543

-

-

-

-

Digiode

USA . 114 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

114

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,941

-

-

-

-

SupplyDigital Components

Austria . 7,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,359

-

-

-

-

Corphita

USA . 862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

862

-

-

-

-

Kulean Microsystems

USA . 791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

791

-

-

-

-

UHIMA Technologies

Türkiye . 564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

564

-

-

-

-

Corohmni

South Africa . 232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

232

-

-

-

-

TANS Electronics

Latvia . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38

-

-

-

-

Overview

Experience seamless digital transmission with the MTC-20172-PC by Onsemi. As a trusted manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. This chip carrier package offers a wide range of applications in digital transmission interfaces, making it ideal for various telecom IC types such as ISDN controllers. With a commercial temperature grade and nominal supply voltage of 5V, the MTC-20172-PC provides customers with exceptional value and performance, making it a must-have for any digital communication setup.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and simplifying production processes.

Package Shape: SQUARE

The square package shape provides a compact design that helps in space-saving and efficient PCB layout.

No. of Terminals: 28

With a high number of terminals, this product can accommodate multiple connections and interfaces, making it versatile and suitable for complex applications.

Package Style: CHIP CARRIER

The chip carrier package style offers good thermal performance and reliable connectivity, ensuring stable operation of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance allows the product to function reliably in various environmental conditions without risk of damage or malfunction.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can operate effectively even in cold environments, enhancing its overall reliability.

Terminal Position: QUAD

The quad terminal position provides a balanced and symmetrical layout for connections, aiding in easier installation and maintenance of the product.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is optimized for standard operating conditions typically found in commercial applications, ensuring consistent performance.

Terminal Form: J BEND

The J bend terminal form offers mechanical strength and secure contact, reducing the risk of disconnection or signal interference during operation.

Telecom IC Type: ISDN CONTROLLER

Being an ISDN controller, this product is specialized for digital transmission interfaces, providing efficient and reliable communication capabilities for telecom applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common and stable power requirement, ensuring compatibility with standard power sources and ease of integration into existing systems.

Technical Specifications

Digital Transmission Interfaces MTC-20172-PC attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J28

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

MTC-20172-PC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20