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MTC-20277PQ-I

Onsemi

MTC-20277PQ-I by Onsemi

MTC-20277PQ-I by Onsemi is a CMOS ISDN controller with 44 terminals in a square flatpack package. It operates b/w -40 to 85 °C, suitable for industrial use. With a nominal voltage of 3.3V, it's ideal for digital transmission interfaces applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,086 parts In-Stock

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Digiode

USA . 1,139 parts In-Stock

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SupplyDigital Components

Austria . 8,282 parts In-Stock

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TANS Electronics

Latvia . 5,502 parts In-Stock

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Kulean Microsystems

USA . 874 parts In-Stock

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Corphita

USA . 641 parts In-Stock

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Problanco Electronics

Mexico . 604 parts In-Stock

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UHIMA Technologies

Türkiye . 107 parts In-Stock

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Corohmni

South Africa . 94 parts In-Stock

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Overview

Upgrade your digital transmission interfaces with the MTC-20277PQ-I by Onsemi, a top-quality solution designed to enhance connectivity and communication systems. Manufactured by Onsemi, a trusted leader in the industry, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this ISDN controller boasts a sleek design and industrial-grade temperature rating, ensuring seamless operation in any setting. Experience the benefits of cutting-edge technology and superior construction with the MTC-20277PQ-I, delivering value and efficiency to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and suitable for electronic devices, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy installation and potentially compact designs.

Package Shape: SQUARE

The square shape can make it easier to integrate into circuit boards or other components.

No. of Terminals: 44

Having a higher number of terminals allows for more connections and functionality.

Package Style (Meter): FLATPACK

The flatpack style can be more space-efficient and easier to work with in tight spaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can be used in a wide range of environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can withstand cold conditions.

Terminal Position: QUAD

Quad terminal position allows for multiple connections in a compact form factor.

Maximum Seated Height: 2.45 mm

Low seated height makes this product suitable for applications where space is limited.

Width: 10 mm

Compact width allows for easy integration into circuit designs.

Length: 10 mm

The small length of the product makes it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals make soldering easier and more reliable.

Telecom IC Type: ISDN CONTROLLER

ISDN controller type is suitable for telecom applications, providing high-speed data transmission.

Nominal Supply Voltage: 3.3 V

Standard voltage supply for easy integration into electronic systems.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density connections in a small space.

Technical Specifications

Digital Transmission Interfaces MTC-20277PQ-I attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MTC-20277PQ-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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