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MTC-20278ILTQ

Onsemi

MTC-20278ILTQ by Onsemi

MTC-20278ILTQ by Onsemi is a Digital Transmission Interfaces IC with 4 functions, 64 terminals, and ISDN controller type. It operates at a nominal voltage of 3.3V in a plastic/epoxy package style suitable for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,331 parts In-Stock

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2,331

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Vyrian

USA . 2,051 parts In-Stock

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2,051

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Distributors (Availability)

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TANS Electronics

Latvia . 7,882 parts In-Stock

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7,882

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SupplyDigital Components

Austria . 2,026 parts In-Stock

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2,026

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Problanco Electronics

Mexico . 1,960 parts In-Stock

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1,960

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Kulean Microsystems

USA . 1,673 parts In-Stock

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1,673

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Corphita

USA . 1,139 parts In-Stock

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1,139

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UHIMA Technologies

Türkiye . 463 parts In-Stock

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463

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Corohmni

South Africa . 412 parts In-Stock

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412

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Overview

Enhance your digital transmission interfaces with the MTC-20278ILTQ by Onsemi. With a reputation for high-quality manufacturing, Onsemi delivers cutting-edge technology that exceeds industry standards. This versatile ISDN controller offers seamless integration and reliable performance in a compact FLATPACK package. Unlock the potential of your telecom applications with the MTC-20278ILTQ, providing customers with unmatched value, efficiency, and reliability. Elevate your communication systems with Onsemi's innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and reducing production costs.

No. of Functions: 4

Having multiple functions in one device increases efficiency and saves space on the circuit board.

No. of Terminals: 64

More terminals provide flexibility in connectivity options and allow for more complex circuit designs.

Package Style (Meter): FLATPACK

Flatpack design is compact and saves space on the circuit board, making it suitable for applications with limited space.

Terminal Position: QUAD

Quad terminal position ensures stable connections and reduces the risk of signal interference or loss.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide a strong and secure connection, enhancing the reliability of the product.

Telecom IC Type: ISDN CONTROLLER

ISDN controller technology ensures efficient and reliable data transmission over telecom networks, making the product suitable for telecommunication applications.

Nominal Supply Voltage: 3.3 V

Operating at a lower supply voltage of 3.3 V reduces power consumption and heat generation, increasing the energy efficiency of the product.

Technical Specifications

Digital Transmission Interfaces MTC-20278ILTQ attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

X-PQFP-G64

No. of Functions:

4

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

MTC-20278ILTQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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