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MTC-20279ILTT

Onsemi

MTC-20279ILTT by Onsemi

MTC-20279ILTT by Onsemi is a Digital SLIC telecom IC with 4 functions, 64 terminals, and operates at a nominal voltage of 3.3V. It features a plastic/epoxy package body material in flatpack style for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,454 parts In-Stock

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2,454

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Vyrian

USA . 1,530 parts In-Stock

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1,530

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,162 parts In-Stock

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6,162

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Kulean Microsystems

USA . 5,180 parts In-Stock

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5,180

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SupplyDigital Components

Austria . 3,828 parts In-Stock

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3,828

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Corphita

USA . 2,380 parts In-Stock

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2,380

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TANS Electronics

Latvia . 2,108 parts In-Stock

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2,108

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Corohmni

South Africa . 459 parts In-Stock

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459

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UHIMA Technologies

Türkiye . 436 parts In-Stock

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436

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Overview

Enhance your digital transmission interfaces with the MTC-20279ILTT by Onsemi, a high-quality product that offers exceptional performance and reliability. Designed with precision and expertise, this telecom IC type is perfect for a wide range of applications. With a flatpack package style and gull wing terminal form, this product boasts 4 functions and 64 terminals for seamless integration. Elevate your projects with the MTC-20279ILTT and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and lightweight material, making the product sturdy yet easy to handle and transport.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort.

No. of Functions: 4

Having multiple functions integrated into one device increases versatility and functionality, offering a comprehensive solution in a single package.

No. of Terminals: 64

With a high number of terminals, the product can accommodate complex connection requirements and offer greater flexibility in circuit design.

Package Style (Meter): FLATPACK

The flatpack design helps in efficient heat dissipation and compact layout, making it suitable for space-constrained applications.

Terminal Position: QUAD

Quad terminal position enables easy and secure soldering and connection, ensuring reliable performance and ease of assembly.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and solder joint reliability, enhancing the overall durability and stability of the product.

Telecom IC Type: DIGITAL SLIC

Digital SLIC technology ensures high quality and clear signal transmission, making it ideal for telecom applications requiring precision and accuracy.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V ensures compatibility with standard power sources, offering ease of integration into various systems.

Technical Specifications

Digital Transmission Interfaces MTC-20279ILTT attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

X-PQFP-G64

No. of Functions:

4

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

MTC-20279ILTT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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