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MTC-20276-PQINTQ

Onsemi

MTC-20276-PQINTQ by Onsemi

MTC-20276-PQINTQ by Onsemi is a digital transmission interface with 44 terminals in a square flatpack package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Telecom IC type ISDN controller with nominal voltage of 3.3V, ideal for telecommunications applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,560 parts In-Stock

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Digiode

USA . 282 parts In-Stock

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282

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TANS Electronics

Latvia . 7,378 parts In-Stock

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7,378

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Problanco Electronics

Mexico . 5,589 parts In-Stock

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Kulean Microsystems

USA . 4,823 parts In-Stock

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Corphita

USA . 1,526 parts In-Stock

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SupplyDigital Components

Austria . 952 parts In-Stock

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UHIMA Technologies

Türkiye . 896 parts In-Stock

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Corohmni

South Africa . 255 parts In-Stock

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Overview

Unlock the potential of your digital transmission interfaces with the MTC-20276-PQINTQ by Onsemi. Manufactured by a trusted industry leader, this product offers unmatched quality and reliability. Ideal for a wide range of applications, this ISDN controller provides seamless connectivity and efficient data transmission. Experience the value of superior performance and innovation with the MTC-20276-PQINTQ - the perfect solution for all your telecom IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Optimal for space-saving designs and efficient use of board real estate.

No. of Terminals: 44

Sufficient number of terminals for versatile connectivity options and compatibility with various systems.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, enhancing reliability and longevity.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of operational environments.

Terminal Position: QUAD

Provides a secure and stable connection for improved signal transmission and reliability.

Maximum Seated Height: 2.35 mm

Low profile design allows for compact and streamlined system integration.

Width: 10 mm

Compact width for efficient use of board space and flexibility in design layouts.

Length: 10 mm

Compact length for space-saving designs and versatile placement options on PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliable performance in demanding environments.

Terminal Form: GULL WING

Provides a reliable and robust terminal connection for enhanced signal integrity and durability.

Telecom IC Type: ISDN CONTROLLER

Specifically designed for ISDN applications, ensuring compatibility and optimized performance.

Nominal Supply Voltage: 3.3 V

Compatible with standard supply voltages, facilitating easy integration into existing systems.

Terminal Pitch: 0.8 mm

Fine pitch for high-density mounting, allowing for compact and efficient PCB designs.

Technical Specifications

Digital Transmission Interfaces MTC-20276-PQINTQ attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MTC-20276-PQINTQ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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