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AFE1205EG4

Texas Instruments

AFE1205EG4 by Texas Instruments

AFE1205EG4 by Texas Instruments is a digital transmission interface IC with 48 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3.3V, data rate of 2.32 Mbps, and is ideal for telecom applications requiring a CMOS technology-based digital SLIC solution.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,973 parts In-Stock

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Vyrian

USA . 2,035 parts In-Stock

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2,035

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Distributors (Availability)

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Native Components

USA . 210 parts In-Stock

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$0.602

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210

$0.602

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Northwest PG Solutions

USA . 233 parts In-Stock

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$0.662

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233

$0.662

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Parana Technologies

USA . 684 parts In-Stock

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$13.315

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$13.824

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684

$13.315

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$13.824

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AZTECH Wire

Italy . 791 parts In-Stock

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$14.478

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791

$14.478

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DigiPath Technology Company

USA . 1,888 parts In-Stock

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$14.662

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$13.489

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1,888

$14.662

$13.489

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ChromeModa Solutions

Germany . 1,626 parts In-Stock

1+ parts

$14.961

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$12.268

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1,626

$14.961

$12.268

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IDEA Electronic Components Group

UK . 671 parts In-Stock

1+ parts

$14.961

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$14.213

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$13.465

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671

$14.961

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One Stop Electronics

USA . 456 parts In-Stock

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$106.000

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456

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Ampacity Inc.

Singapore . 1,465 parts In-Stock

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$153.000

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$153.000

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Semicontronic

India . 743 parts In-Stock

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$692.000

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$674.700

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$671.240

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743

$692.000

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Corphita

USA . 2,326 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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Overview

Unlock the power of seamless digital transmission with the AFE1205EG4 by Texas Instruments. Crafted with precision and expertise, this innovative solution is designed to elevate your communication systems to new heights. Whether you're in telecommunications, industrial automation, or beyond, this cutting-edge product offers unmatched quality, reliability, and performance. Experience the difference with Texas Instruments and revolutionize your connectivity today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the circuit board.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board.

Power Supplies (V): 3.3,5

Support for multiple power supply options provides flexibility in different operating environments.

No. of Terminals: 48

Having 48 terminals allows for multiple connections and functionalities in the product.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style makes the product compact and space-efficient.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures as low as -40°C, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position ensures secure connections and reliable performance of the product.

Maximum Seated Height: 2.79 mm

The low maximum seated height of 2.79 mm helps in maintaining a slim profile for the product.

Width: 7.5 mm

Compact width of 7.5 mm contributes to space-saving design and efficient use of space on the circuit board.

Length: 15.875 mm

The length of 15.875 mm strikes a balance between compact design and accommodating all necessary components.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in harsh industrial conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections for the product.

Telecom IC Type: DIGITAL SLIC

Digital SLIC technology ensures high-quality and reliable transmission of digital signals in telecommunications applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent performance of the product.

Terminal Pitch: 0.635 mm

The fine terminal pitch of 0.635 mm allows for precise connections and compact design of the product.

Data Rate: 2.32 Mbps

High data rate of 2.32 Mbps enables fast and efficient transmission of data in the product.

Technical Specifications

Digital Transmission Interfaces AFE1205EG4 attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2.32 Mbps

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

AFE1205EG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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