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AFE1302Y/250G4

Texas Instruments

AFE1302Y/250G4 by Texas Instruments

AFE1302Y/250G4 by Texas Instruments is a digital transmission interface with 48 terminals, operating at 3.3V and 5V. It features a data rate of 141.312 Mbps, suitable for telecom applications requiring high-speed digital SLIC functionality in commercial temperature environments. The package style is flatpack with thin profile and fine pitch, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,621 parts In-Stock

1+ parts

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3,621

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Vyrian

USA . 2,572 parts In-Stock

1+ parts

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2,572

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 36 parts In-Stock

1+ parts

$0.109

100+ parts

-

1k+ parts

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10k+ parts

$0.105

36

$0.109

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-

$0.105

Northwest PG Solutions

USA . 542 parts In-Stock

1+ parts

$0.120

100+ parts

-

1k+ parts

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$0.106

542

$0.120

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-

$0.106

AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$9.936

100+ parts

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358

$9.936

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Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

$14.851

100+ parts

$1,379.181

1k+ parts

$13.366

10k+ parts

-

1,399

$14.851

$1,379.181

$13.366

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DigiPath Technology Company

USA . 582 parts In-Stock

1+ parts

$16.353

100+ parts

$15.045

1k+ parts

-

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582

$16.353

$15.045

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ChromeModa Solutions

Germany . 4,180 parts In-Stock

1+ parts

$16.687

100+ parts

$13.683

1k+ parts

-

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4,180

$16.687

$13.683

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IDEA Electronic Components Group

UK . 1,178 parts In-Stock

1+ parts

$16.687

100+ parts

$15.853

1k+ parts

$15.018

10k+ parts

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1,178

$16.687

$15.853

$15.018

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One Stop Electronics

USA . 1,006 parts In-Stock

1+ parts

$954.000

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1,006

$954.000

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Microchip USA

USA . 4,729 parts In-Stock

1+ parts

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4,729

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Corphita

USA . 1,696 parts In-Stock

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1,696

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Overview

Elevate your digital transmission interfaces with the AFE1302Y/250G4 from Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers top-of-the-line solutions for a wide range of applications. With its compact design, flexible power supplies, and high-speed data rate, this product offers unmatched value and performance to customers seeking reliable connectivity and seamless communication. Experience the benefits of Texas Instruments' expertise in telecom ICs and elevate your digital transmission experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

No. of Terminals: 48

With 48 terminals, this product offers a high level of connectivity and functionality, making it suitable for complex digital transmission interfaces.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can perform reliably even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions, ensuring versatility.

Data Rate: 141.312 Mbps

The high data rate of 141.312 Mbps enables fast and efficient data transmission, making the product ideal for high-speed applications.

Technical Specifications

Digital Transmission Interfaces AFE1302Y/250G4 attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

141.312 Mbps

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

AFE1302Y/250G4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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