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AFE1230E/1K

Texas Instruments

AFE1230E/1K by Texas Instruments

AFE1230E/1K by Texas Instruments is a digital transmission interface IC with 28 terminals, operating at -40 to 85°C. It features a data rate of 2.5 Mbps, suitable for telecom applications requiring a supply voltage of 3.3V and peak reflow temperature of 260°C. The compact package style and gull wing terminal form make it ideal for industrial use in small outline designs.

Median Price

$28.270

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 6,854 parts In-Stock

1+ parts

-

100+ parts

$28.270

1k+ parts

-

10k+ parts

-

6,854

-

$28.270

-

-

Rochester

USA . 5,502 parts In-Stock

1+ parts

-

100+ parts

$24.460

1k+ parts

$21.890

10k+ parts

$20.600

5,502

-

$24.460

$21.890

$20.600

Verical

USA . 3,779 parts In-Stock

1+ parts

-

100+ parts

$30.575

1k+ parts

$27.363

10k+ parts

$25.750

3,779

-

$30.575

$27.363

$25.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$24.240

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$24.240

-

-

-

Digiode

USA . 1,750 parts In-Stock

1+ parts

$25.821

100+ parts

-

1k+ parts

-

10k+ parts

-

1,750

$25.821

-

-

-

DigiKey Marketplace

USA . 6,854 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,854

-

-

-

-

Vyrian

USA . 5,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,701

-

-

-

-

VNN

France . 3,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,602

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,045 parts In-Stock

1+ parts

$11.048

100+ parts

-

1k+ parts

-

10k+ parts

-

1,045

$11.048

-

-

-

Parana Technologies

USA . 556 parts In-Stock

1+ parts

$12.982

100+ parts

-

1k+ parts

$13.474

10k+ parts

-

556

$12.982

-

$13.474

-

DigiPath Technology Company

USA . 698 parts In-Stock

1+ parts

$14.295

100+ parts

-

1k+ parts

-

10k+ parts

-

698

$14.295

-

-

-

ChromeModa Solutions

Germany . 2,698 parts In-Stock

1+ parts

$14.587

100+ parts

$11.961

1k+ parts

-

10k+ parts

-

2,698

$14.587

$11.961

-

-

IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$14.587

100+ parts

$13.858

1k+ parts

$13.128

10k+ parts

-

610

$14.587

$13.858

$13.128

-

One Stop Electronics

USA . 5,475 parts In-Stock

1+ parts

$23.100

100+ parts

-

1k+ parts

-

10k+ parts

-

5,475

$23.100

-

-

-

Continental Prestige Electronics

USA . 6,129 parts In-Stock

1+ parts

$24.240

100+ parts

-

1k+ parts

-

10k+ parts

$23.755

6,129

$24.240

-

-

$23.755

Corphita

USA . 5,388 parts In-Stock

1+ parts

$24.462

100+ parts

-

1k+ parts

-

10k+ parts

-

5,388

$24.462

-

-

-

Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$23.755

1k+ parts

$23.028

10k+ parts

$22.543

500

-

$23.755

$23.028

$22.543

Argo Parts USA

USA . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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305

-

-

-

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Microchip USA

USA . 122 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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122

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-

-

Overview

Elevate your digital transmission interfaces with the AFE1230E/1K by Texas Instruments. Crafted with precision and expertise, this product boasts high-quality materials and advanced technology, making it a top choice for various applications. From telecommunications to industrial automation, this versatile device offers unmatched performance and reliability. Experience seamless connectivity and enhanced efficiency with the AFE1230E/1K, delivering exceptional value and benefits to meet all your needs. Choose Texas Instruments for cutting-edge solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and protection for the internal components of the digital transmission interface.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the digital transmission interface onto a circuit board.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages allows for flexibility in design and compatibility with various systems.

No. of Terminals: 28

Having a high number of terminals enables connection to multiple components, increasing the functionality and compatibility of the digital transmission interface.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Data Rate: 2.5 Mbps

The high data rate of 2.5 Mbps allows for fast and efficient transmission of digital signals, making this product suitable for high-speed communication applications.

Technical Specifications

Digital Transmission Interfaces AFE1230E/1K attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2.5 Mbps

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

AFE1230E/1K Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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