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AFE1105EA

Texas Instruments

AFE1105EA by Texas Instruments

AFE1105EA by Texas Instruments is a digital transmission interface with 48 terminals, operating at 3.3V nominal voltage and 0.512 Mbps data rate. It features a small outline package style for industrial temperature grade applications in telecom ICs, utilizing CMOS technology for reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,463 parts In-Stock

1+ parts

-

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3,463

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Vyrian

USA . 2,536 parts In-Stock

1+ parts

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2,536

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 780 parts In-Stock

1+ parts

$0.829

100+ parts

-

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780

$0.829

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Northwest PG Solutions

USA . 304 parts In-Stock

1+ parts

$0.912

100+ parts

-

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304

$0.912

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Parana Technologies

USA . 495 parts In-Stock

1+ parts

$9.044

100+ parts

-

1k+ parts

$9.707

10k+ parts

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495

$9.044

-

$9.707

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DigiPath Technology Company

USA . 1,368 parts In-Stock

1+ parts

$9.959

100+ parts

-

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1,368

$9.959

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ChromeModa Solutions

Germany . 2,491 parts In-Stock

1+ parts

$10.162

100+ parts

$8.333

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-

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2,491

$10.162

$8.333

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IDEA Electronic Components Group

UK . 1,129 parts In-Stock

1+ parts

$10.162

100+ parts

$9.654

1k+ parts

$9.146

10k+ parts

-

1,129

$10.162

$9.654

$9.146

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AZTECH Wire

Italy . 587 parts In-Stock

1+ parts

$19.407

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587

$19.407

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One Stop Electronics

USA . 746 parts In-Stock

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$623.000

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746

$623.000

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Corphita

USA . 4,005 parts In-Stock

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4,005

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Overview

Unlock the power of seamless digital transmission with the AFE1105EA by Texas Instruments. Manufactured with precision and expertise, this device offers unparalleled quality and reliability. Ideal for a wide range of applications in the field of digital transmission interfaces, this product provides exceptional value and benefits to customers. With its compact design and advanced technology, the AFE1105EA ensures optimal performance and efficiency, making it a must-have for all your digital communication needs. Trust Texas Instruments to deliver cutting-edge solutions that drive innovation and success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product light-weight and durable, which is ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the product on circuit boards, saving time and space.

Power Supplies (V): 3.3/5,5

The availability of multiple power supply options gives flexibility in designing and integrating the product into different systems with varying power requirements.

No. of Terminals: 48

Having a high number of terminals allows for connectivity to a wide range of other devices and components, enhancing the versatility of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Data Rate: 0.512 Mbps

The high data rate capability of 0.512 Mbps allows for fast and efficient transmission of digital signals, making the product suitable for high-speed communication applications.

Technical Specifications

Digital Transmission Interfaces AFE1105EA attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

.512 Mbps

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

AFE1105EA Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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