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AFE1124E/1KG4

Texas Instruments

AFE1124E/1KG4 by Texas Instruments

AFE1124E/1KG4 by Texas Instruments is a digital transmission interface IC with 28 terminals, operating at 3.3V nominal voltage and data rate of 1.168 Mbps. It is designed for industrial telecom applications, featuring CMOS technology, dual terminal position, and small outline package style for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,096 parts In-Stock

1+ parts

-

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7,096

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Digiode

USA . 3,020 parts In-Stock

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3,020

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 30 parts In-Stock

1+ parts

$0.213

100+ parts

-

1k+ parts

-

10k+ parts

$0.204

30

$0.213

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-

$0.204

Northwest PG Solutions

USA . 2,276 parts In-Stock

1+ parts

$0.234

100+ parts

-

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$0.207

2,276

$0.234

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-

$0.207

AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$7.970

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838

$7.970

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Parana Technologies

USA . 898 parts In-Stock

1+ parts

$13.305

100+ parts

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$13.812

10k+ parts

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898

$13.305

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$13.812

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DigiPath Technology Company

USA . 2,221 parts In-Stock

1+ parts

$14.650

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2,221

$14.650

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ChromeModa Solutions

Germany . 5,892 parts In-Stock

1+ parts

$14.949

100+ parts

$12.258

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5,892

$14.949

$12.258

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IDEA Electronic Components Group

UK . 1,609 parts In-Stock

1+ parts

$14.949

100+ parts

$14.202

1k+ parts

$13.454

10k+ parts

-

1,609

$14.949

$14.202

$13.454

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One Stop Electronics

USA . 1,120 parts In-Stock

1+ parts

$878.000

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1,120

$878.000

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Corphita

USA . 3,839 parts In-Stock

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3,839

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Overview

Experience seamless digital transmission with the AFE1124E/1KG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The AFE1124E/1KG4 is perfect for various applications in the digital transmission interfaces category. With its unique features and advanced technology, this product offers exceptional value, benefits, and advantages to customers looking for high-performance solutions. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the device.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more convenient.

Power Supplies (V): 3.3/5,5

The availability of multiple power supply options allows for flexibility in different application scenarios.

No. of Terminals: 28

Having a sufficient number of terminals enables efficient connectivity with other components in the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold for terminal finish ensures good electrical conductivity and corrosion resistance.

Data Rate: 1.168 Mbps

The high data rate enables fast and efficient transmission of digital signals.

Moisture Sensitivity Level (MSL): 2

Having a low moisture sensitivity level helps to prevent damage from exposure to humidity and moisture.

Technical Specifications

Digital Transmission Interfaces AFE1124E/1KG4 attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

1.168 Mbps

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

AFE1124E/1KG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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