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MTC-20278PQ-C

Onsemi

MTC-20278PQ-C by Onsemi

MTC-20278PQ-C by Onsemi is a digital transmission interface IC with 80 terminals in a rectangular flatpack package. It operates b/w 0 to 70 °C, suitable for ISDN controller applications. With a terminal pitch of 0.8mm and supply voltage of 3.3V, it offers high performance in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,579 parts In-Stock

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Vyrian

USA . 1,142 parts In-Stock

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1,142

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Kulean Microsystems

USA . 6,083 parts In-Stock

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6,083

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Problanco Electronics

Mexico . 4,016 parts In-Stock

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4,016

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TANS Electronics

Latvia . 2,392 parts In-Stock

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2,392

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SupplyDigital Components

Austria . 2,042 parts In-Stock

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Corphita

USA . 1,410 parts In-Stock

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1,410

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UHIMA Technologies

Türkiye . 360 parts In-Stock

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360

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Corohmni

South Africa . 189 parts In-Stock

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Overview

Enhance your digital transmission interfaces with the MTC-20278PQ-C by Onsemi. Crafted with precision and expertise, this product exudes quality and reliability that Onsemi is renowned for. From ISDN controllers to telecom applications, this versatile component offers unmatched value and benefits to customers seeking seamless connectivity solutions. Elevate your projects with the advantages of Onsemi's MTC-20278PQ-C and experience unparalleled performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to moisture and temperature changes, making this product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and quick installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular shape enables efficient placement and utilization of space on the circuit board.

No. of Terminals: 80

With a high number of terminals, this product can accommodate a complex network of connections, making it versatile for various system designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperature environments, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0 °C makes this product suitable for use in a wide range of environments, including refrigerated settings.

Terminal Position: QUAD

Quad terminal position allows for secure connections and efficient signal transmission, contributing to the overall reliability of the product.

Width: 14 mm

Compact width of 14 mm enables space-saving design and integration into tight spaces within electronic systems.

Length: 20 mm

With a length of 20 mm, this product offers a balanced form factor that can fit well within various device configurations.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product is suitable for standard commercial applications, offering a cost-effective solution for a wide range of projects.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this product is compatible with common voltage standards, simplifying integration and power management.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this product allows for precise and compact connections, facilitating high-density PCB layouts and efficient signal routing.

Technical Specifications

Digital Transmission Interfaces MTC-20278PQ-C attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

MTC-20278PQ-C Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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