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MTC-20277PC-I

Onsemi

MTC-20277PC-I by Onsemi

MTC-20277PC-I by Onsemi is a CMOS ISDN controller with 44 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 3.3V and J bend terminal form, it's ideal for digital transmission interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,225 parts In-Stock

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Vyrian

USA . 621 parts In-Stock

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SupplyDigital Components

Austria . 5,948 parts In-Stock

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Kulean Microsystems

USA . 3,667 parts In-Stock

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UHIMA Technologies

Türkiye . 968 parts In-Stock

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Corphita

USA . 602 parts In-Stock

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Problanco Electronics

Mexico . 295 parts In-Stock

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Corohmni

South Africa . 206 parts In-Stock

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TANS Electronics

Latvia . 12 parts In-Stock

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Overview

Unleash the power of digital transmission with the MTC-20277PC-I by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The MTC-20277PC-I is perfect for a wide range of applications in ISDN controllers, offering unmatched performance and efficiency. With its industrial-grade temperature range and advanced CMOS technology, this chip carrier package ensures seamless operation even in the most demanding environments. Elevate your projects with the MTC-20277PC-I and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material is cost-effective and lightweight, making the product easy to handle and install.

Surface Mount: YES

Surface mount technology allows for easy installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board.

No. of Terminals: 44

Having a high number of terminals allows for more connectivity options and functionality in the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and protection for the electronic components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can perform reliably in a variety of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold conditions without issues.

Terminal Position: QUAD

The quad terminal position provides efficient routing of signals and ease of connection within the product.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a slim design, making the product suitable for compact applications.

Width: 16.585 mm

The moderate width of the product allows for easy integration into circuit board layouts.

Length: 16.585 mm

The compact length of the product saves space on the circuit board and in the overall system design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh environmental conditions in industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: J BEND

The J bend terminal form provides mechanical stability and ease of soldering during assembly.

Telecom IC Type: ISDN CONTROLLER

Being an ISDN controller, the product supports high-speed digital data transmission over telephone lines, making it suitable for telecom applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is standard, making the product compatible with a wide range of electronic systems.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting of components on the circuit board, increasing functionality in a compact space.

Technical Specifications

Digital Transmission Interfaces MTC-20277PC-I attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.585 mm

Trade Compliance

MTC-20277PC-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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