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MTC-20232PQ-C

Onsemi

MTC-20232PQ-C by Onsemi

MTC-20232PQ-C by Onsemi is a digital transmission interface IC with 44 terminals in a square, low-profile flatpack package. Featuring gull wing terminal form and 0.8mm pitch, it is ideal for telecom applications as a digital SLIC. With a compact size of 10x10mm and seated height of 1.6mm, this surface-mount IC offers high performance in telecommunications systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

LIBRA Elektronik GmbH

Germany . 26,400 parts In-Stock

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26,400

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Vyrian

USA . 1,792 parts In-Stock

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1,792

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Bristol Electronics

USA . 480 parts In-Stock

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480

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Dan-Mar Components

USA . 480 parts In-Stock

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480

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Digiode

USA . 347 parts In-Stock

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347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 6,459 parts In-Stock

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6,459

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Kulean Microsystems

USA . 6,326 parts In-Stock

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6,326

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SupplyDigital Components

Austria . 6,322 parts In-Stock

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6,322

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TANS Electronics

Latvia . 3,032 parts In-Stock

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3,032

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Kepictronics

USA . 2,941 parts In-Stock

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2,941

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Corphita

USA . 1,191 parts In-Stock

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1,191

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 378 parts In-Stock

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378

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Corohmni

South Africa . 73 parts In-Stock

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73

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Overview

Discover the cutting-edge MTC-20232PQ-C by Onsemi, a top-of-the-line digital transmission interface that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet the highest standards of performance. From telecommunications to data transmission, this versatile device excels in various applications. With a sleek package design and easy installation, the MTC-20232PQ-C provides customers with exceptional value, efficiency, and functionality. Upgrade your systems with this innovative solution and experience the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection for the internal components and helps maintain the integrity of the product during handling and installation.

Surface Mount: YES

Being surface mount compatible makes it easier to integrate this product into printed circuit boards, reducing assembly time and complexity.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it ideal for designs where space optimization is crucial.

No. of Terminals: 44

Having 44 terminals provides ample connectivity options, allowing for versatile applications and connectivity to multiple devices or components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style saves space on the PCB, making it suitable for designs with height restrictions or limited space.

Terminal Position: QUAD

The quad terminal position ensures stable and secure connections, reducing the risk of signal loss or disconnections during operation.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact and slim design, making it suitable for applications where space is limited or where a sleek profile is desired.

Width: 10 mm

The 10mm width offers a compact footprint, enabling efficient use of space on the PCB and facilitating design flexibility.

Length: 10 mm

The 10mm length contributes to the overall compactness of the product, ensuring it can fit into tight spaces or applications with size constraints.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust connections, enhancing reliability and durability of the product in various operating conditions.

Telecom IC Type: DIGITAL SLIC

Being a digital SLIC (subscriber line interface circuit) ensures high-quality transmission of digital signals, making it suitable for telecom applications requiring reliable data transfer.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for close spacing of terminals, enabling high-density connections and compact PCB layouts, ideal for space-constrained designs.

Technical Specifications

Digital Transmission Interfaces MTC-20232PQ-C attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Terminals:

44

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MTC-20232PQ-C Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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