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MTC-20278PQ-I

Onsemi

MTC-20278PQ-I by Onsemi

The Onsemi MTC-20278PQ-I is a digital transmission interface IC with 80 terminals in a rectangular flatpack package. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Features include ISDN controller type, 3.3V supply voltage, and gull wing terminal form at 0.8mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,835 parts In-Stock

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Vyrian

USA . 1,578 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 330 parts In-Stock

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SupplyDigital Components

Austria . 6,826 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,964 parts In-Stock

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Problanco Electronics

Mexico . 4,154 parts In-Stock

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TANS Electronics

Latvia . 3,436 parts In-Stock

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Kulean Microsystems

USA . 3,403 parts In-Stock

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Corphita

USA . 1,276 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 902 parts In-Stock

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UHIMA Technologies

Türkiye . 751 parts In-Stock

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Perfect Parts

USA . 739 parts In-Stock

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Metaverse IC Inc.

Canada . 420 parts In-Stock

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Kepictronics

USA . 320 parts In-Stock

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Corohmni

South Africa . 311 parts In-Stock

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Futuretech Components

Singapore . 290 parts In-Stock

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Overview

Discover the cutting-edge MTC-20278PQ-I by Onsemi, a top-tier manufacturer known for their superior quality and reliability. This digital transmission interface offers unmatched performance and seamless connectivity in a compact and durable package. Ideal for applications in telecommunications, data centers, and networking, this product ensures smooth operations and enhanced productivity. Experience the value and benefits of Onsemi's MTC-20278PQ-I, delivering high-quality results that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Allows for easy installation on circuit boards, reducing assembly time and cost.

No. of Terminals: 80

Provides ample connectivity options for various devices and peripherals, enhancing the product's versatility.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments, making it suitable for industrial use.

Nominal Supply Voltage: 3.3 V

Compatible with common voltage standards, making it easy to integrate into existing systems.

Terminal Pitch: 0.8 mm

Allows for high-density mounting, saving space on the circuit board and enabling compact designs.

Technical Specifications

Digital Transmission Interfaces MTC-20278PQ-I attributes and parameters. Explore more Digital Transmission Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PQFP-G80

Length:

20 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

MTC-20278PQ-I Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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