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TP3420AV309

Texas Instruments

TP3420AV309 by Texas Instruments

TP3420AV309 by Texas Instruments is a digital transmission interface chip carrier with 20 terminals. Operating at 5V, it supports basic ISDN access rate at 0.192 Mbps. Ideal for telecom applications, this CMOS technology IC has a temperature range of 0-70°C and terminal pitch of 1.27mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,109 parts In-Stock

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Vyrian

USA . 2,541 parts In-Stock

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Anansix

USA . 2,205 parts In-Stock

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Bristol Electronics

USA . 1,171 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 518 parts In-Stock

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Dan-Mar Components

USA . 518 parts In-Stock

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518

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Inventory MP

USA . 171 parts In-Stock

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Inland Empire Components Inc.

USA . 115 parts In-Stock

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R&J Components

USA . 78 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 5 parts In-Stock

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Parana Technologies

USA . 1,671 parts In-Stock

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$7.115

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$7.631

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$7.115

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$7.631

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ChromeModa Solutions

Germany . 2,141 parts In-Stock

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$7.994

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$6.555

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$7.994

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IDEA Electronic Components Group

UK . 1,331 parts In-Stock

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$7.994

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$7.195

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AZTECH Wire

Italy . 727 parts In-Stock

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$9.083

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One Stop Electronics

USA . 1,301 parts In-Stock

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$587.000

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QUARKTWIN TECHNOLOGY LTD

USA . 14,984 parts In-Stock

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Microchip USA

USA . 5,124 parts In-Stock

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Corphita

USA . 2,204 parts In-Stock

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DigiPath Technology Company

USA . 2,162 parts In-Stock

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$7.207

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Assy Fe

Spain . 1,862 parts In-Stock

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Metaverse IC Inc.

Canada . 1,247 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Experience seamless digital transmission with the TP3420AV309 by Texas Instruments. Known for their cutting-edge technology and reliable products, Texas Instruments delivers top-notch quality in the field of Digital Transmission Interfaces. This versatile chip carrier package offers a BASIC ISDN Access Rate and 20 terminals, making it ideal for a wide range of telecom applications. With a power supply of 5V and commercial-grade temperature tolerance, this product ensures consistent performance in various environments. Trust Texas Instruments for unparalleled value and innovation in digital communication solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, making it suitable for various environments and conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 5

Operates effectively with a standard voltage supply, ensuring compatibility with existing systems.

ISDN Access Rate: BASIC

Suitable for basic ISDN access needs, making it a cost-effective solution for small-scale applications.

No. of Terminals: 20

Provides ample connectivity options for different components, enhancing the versatility of the product.

Minimum Operating Temperature: 0 °C

Can operate efficiently in a wide range of temperature conditions, ensuring reliability in various environments.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation, making it energy-efficient.

Nominal Supply Voltage: 5 V

Standard voltage supply requirement makes it easy to integrate into existing systems without the need for additional modifications.

Moisture Sensitivity Level (MSL): 2A

With MSL level 2A, the product has a moderate level of moisture sensitivity, ensuring reliability during handling and assembly processes.

Technical Specifications

Digital Transmission Interfaces TP3420AV309 attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

.192 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.89 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

3.2 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

S/T

Maximum Seated Height:

4.57 mm

Standard:

CCITT I.430

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

TP3420AV309 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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