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TP3420AN

Texas Instruments

TP3420AN by Texas Instruments

TP3420AN by Texas Instruments is a CMOS digital SLIC with 20 terminals in an in-line package. It operates b/w 0-70°C, ideal for commercial telecom applications. With a compact size of 7.62mm width and 26.075mm length, it offers a nominal voltage of 5V for reliable digital transmission interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,970 parts In-Stock

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Digiode

USA . 1,853 parts In-Stock

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1,853

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Anansix

USA . 1,352 parts In-Stock

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1,352

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Greenchips

USA . 256 parts In-Stock

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256

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SIE Connect GmbH - GreenChips

Germany . 256 parts In-Stock

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256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$5.520

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764

$5.520

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Parana Technologies

USA . 743 parts In-Stock

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$10.924

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$11.392

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743

$10.924

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$11.392

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DigiPath Technology Company

USA . 2,347 parts In-Stock

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$12.029

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$11.066

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2,347

$12.029

$11.066

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ChromeModa Solutions

Germany . 2,326 parts In-Stock

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$12.274

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$10.065

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2,326

$12.274

$10.065

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IDEA Electronic Components Group

UK . 867 parts In-Stock

1+ parts

$12.274

100+ parts

$11.660

1k+ parts

$11.047

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867

$12.274

$11.660

$11.047

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$17.268

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$17.096

1k+ parts

$16.405

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3,000

$17.268

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$16.405

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One Stop Electronics

USA . 198 parts In-Stock

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$322.000

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Corphita

USA . 4,911 parts In-Stock

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4,911

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Overview

Upgrade your digital transmission interfaces with the TP3420AN by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you a product that offers unparalleled value and benefits. This versatile device is perfect for a wide range of applications, providing seamless communication in various systems. Say goodbye to connectivity issues and hello to smooth operations with the TP3420AN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for electronic components.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and placement in electronic setups.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and interfaces, providing versatility in usage.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand various environmental conditions.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, improving the efficiency of the product.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, the product can operate efficiently with common power sources.

Technical Specifications

Digital Transmission Interfaces TP3420AN attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.075 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TP3420AN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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