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TP3420AV309/NOPB

Texas Instruments

TP3420AV309/NOPB by Texas Instruments

TP3420AV309/NOPB by Texas Instruments is a CMOS digital transmission interface chip carrier with 20 terminals. Operating at 5V, it supports basic ISDN access rate at 0.192 Mbps. Ideal for telecom applications, it features a quad terminal position and matte tin finish in a compact square package style.

Median Price

$10.102

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,174 parts In-Stock

1+ parts

-

100+ parts

$8.980

1k+ parts

$8.030

10k+ parts

$7.560

6,174

-

$8.980

$8.030

$7.560

Verical

USA . 6,174 parts In-Stock

1+ parts

-

100+ parts

$11.225

1k+ parts

$10.037

10k+ parts

$9.450

6,174

-

$11.225

$10.037

$9.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,466 parts In-Stock

1+ parts

$9.472

100+ parts

-

1k+ parts

-

10k+ parts

-

3,466

$9.472

-

-

-

Vyrian

USA . 1,036 parts In-Stock

1+ parts

$9.970

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

$9.970

-

-

-

Anansix

USA . 1,937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,937

-

-

-

-

Speed Components Ltd

Israel . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,135 parts In-Stock

1+ parts

$8.973

100+ parts

-

1k+ parts

-

10k+ parts

-

3,135

$8.973

-

-

-

Parana Technologies

USA . 518 parts In-Stock

1+ parts

$10.647

100+ parts

-

1k+ parts

$11.139

10k+ parts

-

518

$10.647

-

$11.139

-

DigiPath Technology Company

USA . 1,478 parts In-Stock

1+ parts

$11.724

100+ parts

$10.786

1k+ parts

-

10k+ parts

-

1,478

$11.724

$10.786

-

-

ChromeModa Solutions

Germany . 1,570 parts In-Stock

1+ parts

$11.963

100+ parts

$9.810

1k+ parts

-

10k+ parts

-

1,570

$11.963

$9.810

-

-

IDEA Electronic Components Group

UK . 500 parts In-Stock

1+ parts

$11.963

100+ parts

$11.365

1k+ parts

$10.767

10k+ parts

-

500

$11.963

$11.365

$10.767

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,802

-

-

-

-

Microchip USA

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,950

-

-

-

-

Overview

Elevate your digital communication with the TP3420AV309/NOPB by Texas Instruments. Crafted with precision and expertise, this Digital Transmission Interface device offers exceptional quality and reliability for your ISDN access needs. Whether you're looking to enhance your telecommunication systems or streamline data transmission, this product delivers seamless performance and unparalleled value. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations, making your connectivity solutions effortless and efficient. Experience the difference with the TP3420AV309/NOPB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, the product is easy to install and saves space on the circuit board.

Power Supplies (V): 5

The 5V power supply ensures stable and reliable operation of the product.

ISDN Access Rate: BASIC

The basic ISDN access rate allows for efficient data transmission over the network.

No. of Terminals: 20

With 20 terminals, the product can accommodate multiple connections and interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and easy handling of the product.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can withstand challenging environmental conditions.

Minimum Output High Voltage: 2.4 V

The minimum output high voltage ensures reliable signal transmission.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function in colder environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and solderability.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Digital Transmission Interfaces TP3420AV309/NOPB attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

.192 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.89 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

3.2 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

S/T

Maximum Seated Height:

4.57 mm

Standard:

CCITT I.430

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.89 mm

Trade Compliance

TP3420AV309/NOPB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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