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TP3403V

Texas Instruments

TP3403V by Texas Instruments

TP3403V by Texas Instruments is a digital transmission interface with 28 terminals, operating at 5V. It features a data rate of 0.144 Mbps and supports ISDN access at basic rates. Ideal for telecom applications requiring a CMOS technology-based digital SLIC solution.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 3,016 parts In-Stock

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Anansix

USA . 1,166 parts In-Stock

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Digiode

USA . 982 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 35 parts In-Stock

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Electronics Depot

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ECAB

Sweden . 6 parts In-Stock

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AZTECH Wire

Italy . 661 parts In-Stock

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$5.779

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Parana Technologies

USA . 157 parts In-Stock

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$12.703

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$13.172

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DigiPath Technology Company

USA . 1,640 parts In-Stock

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$13.988

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$12.869

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ChromeModa Solutions

Germany . 4,976 parts In-Stock

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$14.273

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$11.704

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IDEA Electronic Components Group

UK . 1,772 parts In-Stock

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$14.273

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$13.559

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$12.846

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One Stop Electronics

USA . 669 parts In-Stock

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$701.000

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Authorized Procurement Solutions

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Corphita

USA . 3,553 parts In-Stock

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Kepictronics

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Microchip USA

USA . 127 parts In-Stock

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A-Plus Industry Inc.

USA . 41 parts In-Stock

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Overview

Looking for reliable and high-quality digital transmission interfaces? Look no further than the TP3403V by Texas Instruments. With a solid reputation for producing top-notch technology, Texas Instruments delivers once again with this versatile product. Perfect for basic ISDN access rate applications, the TP3403V offers customers value and benefits that can't be beat. Trust in Texas Instruments for all your digital transmission interface needs and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and improving overall design flexibility.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard power sources and helps in efficient operation of the product.

ISDN Access Rate: BASIC

The basic ISDN access rate provides a decent level of connectivity for most users while keeping the product cost-effective.

No. of Terminals: 28

Having 28 terminals allows for proper connectivity and versatility in connecting the product with other devices or components.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good electrical conductivity and reliability in data transmission.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Data Rate: 0.144 Mbps

With a data rate of 0.144 Mbps, the product can handle moderate to high-speed data transmission requirements efficiently.

Technical Specifications

Digital Transmission Interfaces TP3403V attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

.144 Mbps

ISDN Access Rate:

BASIC

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

2A

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Output High Voltage:

2.4 V

Maximum Output Low Current:

1 Amp

Maximum Output Low Voltage:

.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Reference Point:

U

Sub-Category:

Digital Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

TP3403V Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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